Infineon SIPMOS N-Channel MOSFET, 21 mA, 600 V Enhancement, 3-Pin SOT-23 BSS127H6327XTSA2

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Subtotal (1 reel of 3000 units)*

R 7 923,00

(exc. VAT)

R 9 111,00

(inc. VAT)

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RS stock no.:
165-7534
Mfr. Part No.:
BSS127H6327XTSA2
Manufacturer:
Infineon
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Brand

Infineon

Product Type

MOSFET

Channel Type

N

Maximum Continuous Drain Current Id

21mA

Maximum Drain Source Voltage Vds

600V

Package Type

SOT-23

Series

SIPMOS

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

600Ω

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

0.65nC

Maximum Gate Source Voltage Vgs

-20V, +20V

Maximum Power Dissipation Pd

500mW

Forward Voltage Vf

820mV

Maximum Operating Temperature

150°C

Standards/Approvals

No

Length

2.9mm

Height

1mm

Width

1.3mm

Automotive Standard

AEC-Q101

Infineon SIPMOS Series MOSFET, 600V Drain Source Voltage, 21mA Continuous Drain Current - BSS127H6327XTSA2


This MOSFET is a high-voltage N-channel transistor designed for surface-mount switching in compact electronic systems. It operates across a wide temperature range for demanding environments and is suitable for applications requiring a rugged, small-footprint device with controlled gate-drive characteristics.

Features and Benefits:


• 600V drain-to-source withstand delivers high-voltage switching capability
• 0.65 nC typical gate charge enables faster, lower-loss switching
• 600 Ω maximum RDS(on) reduces off-state leakage in high-voltage circuits
• 21 mA continuous drain current suits low-current control functions
• 500 mW maximum power dissipation manages thermal loading in compact layouts
• VGS rated to 20V allows compatibility with common gate-drive voltages

Applications


• Suitable for high-voltage power-conversion topologies
• Ideal for automotive-grade sensor and auxiliary circuits
• Used with compact switching regulators and flyback stages
• Can be used for gate-level signal translation in protection circuits
• Suitable for small-form-factor power-management modules

What package and mounting style does it use for PCB assembly?


It is supplied in a SOT-23 package intended for surface-mount placement and reflow soldering.

What thermal extremes can it withstand during operation?


The device is specified to operate between -55 °C and 150 °C, supporting wide thermal excursions in harsh environments.

How many electrical connections are available for circuit integration?


The component uses a three-pin configuration compatible with typical discrete MOSFET layouts.

Is the device qualified for automotive applications?


It meets the AEC-Q101 standard, indicating suitability for automotive electronic use.

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