Infineon F475R06W1E3BOMA1 Emitter-Collector, Quad (2 x Dual) IGBT Module, 100 A 600 V
- RS stock no.:
- 244-5369
- Mfr. Part No.:
- F475R06W1E3BOMA1
- Manufacturer:
- Infineon
Bulk discount available
Subtotal (1 tray of 24 units)*
R 16 500,36
(exc. VAT)
R 18 975,408
(inc. VAT)
FREE delivery for orders over R 1,500.00
Temporarily out of stock
- Shipping from 08 July 2027
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Tray* |
|---|---|---|
| 24 - 24 | R 687.515 | R 16,500.36 |
| 48 - 48 | R 670.327 | R 16,087.85 |
| 72 + | R 650.217 | R 15,605.21 |
*price indicative
- RS stock no.:
- 244-5369
- Mfr. Part No.:
- F475R06W1E3BOMA1
- Manufacturer:
- Infineon
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Maximum Continuous Collector Current | 100 A | |
| Maximum Collector Emitter Voltage | 600 V | |
| Maximum Gate Emitter Voltage | +/-20V | |
| Maximum Power Dissipation | 275 W | |
| Number of Transistors | 4 | |
| Configuration | Emitter-Collector, Quad (2 x Dual) | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Maximum Continuous Collector Current 100 A | ||
Maximum Collector Emitter Voltage 600 V | ||
Maximum Gate Emitter Voltage +/-20V | ||
Maximum Power Dissipation 275 W | ||
Number of Transistors 4 | ||
Configuration Emitter-Collector, Quad (2 x Dual) | ||
The infineon IGBT module is suitable for auxiliary inverters, UPS systems, inductive heating and welding and solar applications etc.
Electrical features
Low switching losses, low inductive design
Trench IGBT 3
VCEsat with positive temperature coefficient
Low VCEsat
Mechanical features
Al2O3 substrate with low thermal resistance
Compact design
Solder contact technology
Rugged mounting due to integrated mounting clamps
Low switching losses, low inductive design
Trench IGBT 3
VCEsat with positive temperature coefficient
Low VCEsat
Mechanical features
Al2O3 substrate with low thermal resistance
Compact design
Solder contact technology
Rugged mounting due to integrated mounting clamps
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