MG Chemicals 832TC-450ML Black Epoxy Epoxy Resin Adhesive 450 ml

RS stock no.:: 918-4992
Mfr. Part No.:: 832TC-450ML
Manufacturer:: MG Chemicals

MG Chemicals 832TC-450ML Black Epoxy Epoxy Resin Adhesive 450 ml

Bulk discount available

Subtotal (1 unit)*

R 1 453,20

(exc. VAT)

R 1 671,18

(inc. VAT)

FREE delivery for orders over R 1,500.00

In Stock

16 unit(s) ready to ship from another location

Need more? Click ‘Check delivery dates’ to find extra stock and lead times.

Units	Per unit
1 - 14	R 1,453.20
15 - 39	R 1,416.87
40 +	R 1,374.36

*price indicative

RS stock no.:: 918-4992
Mfr. Part No.:: 832TC-450ML
Manufacturer:: MG Chemicals

Specification

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	MG Chemicals
	Product Material	Epoxy
	Package Type	Can
	Package Size	450 ml
	Special Properties	Thermal Conductivity
	Cure Time	2 → 96 h
	Colour	Black
	Maximum Operating Temperature	+140°C
	Minimum Operating Temperature	-30°C
	Specific Gravity	1.6156
	Viscosity Measurement	38000 → 40000cP/s
	Chemical Composition	Acetone, Ethyl Lactate, Hydrocloric Acid, Isohexanes, Isopropyl Alcohol, Mineral Spirits, Xylene
	Physical Form	Liquid
	Operating Temperature Range	-30 → +140 °C
	Setting Time	120min

	Select all
	Brand MG Chemicals
	Product Material Epoxy
	Package Type Can
	Package Size 450 ml
	Special Properties Thermal Conductivity
	Cure Time 2 → 96 h
	Colour Black
	Maximum Operating Temperature +140°C
	Minimum Operating Temperature -30°C
	Specific Gravity 1.6156
	Viscosity Measurement 38000 → 40000cP/s
	Chemical Composition Acetone, Ethyl Lactate, Hydrocloric Acid, Isohexanes, Isopropyl Alcohol, Mineral Spirits, Xylene
	Physical Form Liquid
	Operating Temperature Range -30 → +140 °C
	Setting Time 120min

COO (Country of Origin):: CA

MG Chemicals Epoxy Potting Compounds

The MG Chemicals two-part epoxy potting compound has been designed to protect your electronic components. The liquid electric grade 832 series epoxy protects your components against static discharges, fungus, thermal shocks, mechanical impact and vibrations.

Feature and Benefits

Impact resistant

Non-conductive

Low toxicity

Improves reliability and operational range

Non-porous, water and chemical resistant

Hard to remove

Available in different colours

Typical Applications

Aviation Industry

Communication Industry

Marine Industry

Car industry

Potting Compounds

The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack.

Note

Refer to the datasheet for more details on how to apply and applications

Caution

Due to exothermic reaction, heat cure temperatures should be at least 25% below the maximum temperature tolerated by the most fragile PCB component. For larger potting blocks, reduce heat cure temperature by greater margins