Potting Compounds

Potting compounds are a general-purpose types of sealant that can offer environmental, mechanical and physical protection to circuit boards and electronic assemblies. Used in electronics, potting is a process of filling a complete electronic assembly with a solid or gelatinous compound. The potting compound, once applied, cured and hardened encases your electronics in a solid mass providing a barrier which provides protection from moisture, vibration, thermal or physical shock and general contamination. The mechanical protection enables the components to maintain high performance under extreme conditions. Thermosetting plastics or silicone rubber gels are often used.

Types of compounds

Epoxy Potting Compounds - Epoxy potting compounds generally perform as a better adhesive, high temperature resistance, and chemical resistance. Epoxy systems have better adhesion to a wide variety of substrates and typically do not need primers. They are easy to use and are predictable. They have good high temperature resistance up to 400°F.

Urethane Potting Compounds - Urethane potting compounds generally have better flexibility, elongation, and abrasion resistance. Since they can have Tg below -40°C they are an excellent selection for SMT PC board potting. Their gel time can be easily changed with an accelerator without changing the properties.

Silicone Potting Compounds - Silicone potting compounds and encapsulating materials are also soft, flexible, and have better elongation. Silicone materials also provide the widest operating temperatures. Specially formulated silicone potting compounds can operate at below -100°C and most silicone materials can handle 200°C temperatures.

Acrylic Potting Compounds - Acrylic potting compounds are UV and heat hardening materials. They benefit from very fast hardening, adequate chemical resistance and are clear in appearance.

Applications of Potting Compounds

Potting compounds are used in a range of applications such as;

  • Military
  • Industrial
  • Automotive industry
  • PCB's
  • Coils

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Description Price Trade Name Product Material Package Type Package Size Special Properties Cure Time Hardness Thermal Conductivity Colour Maximum Operating Temperature Minimum Operating Temperature Chemical Composition Dielectric Strength Odour
RS stock no. 160-8481
Mfr. Part No.UR5041RP250G
R 692.81
Each
units
UR5041 PUR Pack 250 g Oxidation Resistance 24 h 85 Shore A - Black +125°C -60°C - - -
RS stock no. 199-1402
BrandRS PRO
R 120.16
Each
units
- Epoxy Pack 50 g Flame Retardant 24 h 85 Shore D 0.45W/mK Black +120°C -40°C Epoxy Resin, Formaldehyde, Neodecanoic Acid Glycidyl Ester, Polymer with 1, 3 Dimethylbenzene 16.6kV/mm Characteristic
RS stock no. 552-668
BrandRS PRO
R 234.46
Each
units
- Epoxy Pack 250 g Chemical Resistance, Water Resistance 24 h 80 Shore D 1.26W/mK White +130°C -40°C [(2Ethylhexyl)Oxy]Methyloxirane, Bis[4-(2, Epoxy Resin, Zinc Oxide, 3-Epoxypropoxy)Phenyl]Propane 10kV/mm -
RS stock no. 851-044
BrandRS PRO
R 182.44
Each
units
- Epoxy Dual Cartridge 50 ml - 12 h - - Black +50°C -20°C Nonylphenol, 2-Piperazin-1-Ylethylamine - Amine-Like
RS stock no. 918-4992
Mfr. Part No.832TC-450ML
R 1,023.97
Each
units
- Epoxy Can 450 ml Thermal Conductivity 2 → 96 h - - Black +140°C -30°C Acetone, Ethyl Lactate, Hydrocloric Acid, Isohexanes, Isopropyl Alcohol, Mineral Spirits, Xylene - -
RS stock no. 448-0242
Mfr. Part No.740010370
R 475.07
Each
units
AS 1603 Silicone Cartridge 310 ml - 1 h 33 Shore A 0.2W/mK Translucent +220°C -50°C - - -
RS stock no. 448-6830
Mfr. Part No.7718-12-250-BKP-TP10-RS
R 250.28
Each
units
- Polyamide Stick - - - - - Black +135°C -10°C - - -
RS stock no. 164-292
Mfr. Part No.UR5044RP250G
R 536.57
Each
units
UR5044 PUR Pack 250 g Reenterable 24 h 40 Shore A, 60 Shore A, 80 Shore A 0.25W/mK Blue +120°C -70°C - - -
RS stock no. 448-0236
Mfr. Part No.740010360
R 461.18
Each
units
AS1621 Silicone Cartridge 310 ml - 24 h 24 Shore A 0.2W/mK White +230°C -50°C - - -
RS stock no. 199-1424
BrandRS PRO
R 260.95
Each
units
- Epoxy Pack 250 g Flame Retardant 24 h 85 Shore D 0.45W/mK Black +120°C -40°C Epoxy Resin, Formaldehyde, Neodecanoic Acid Glycidyl Ester, Polymer with 1, 3 Dimethylbenzene 16.6kV/mm Characteristic
RS stock no. 918-4986
Mfr. Part No.832C-375ML
R 567.71
Each
units
- Epoxy Can 375 ml - 35 min → 24 h - - Translucent +145°C -30°C Alkyl Glycidyl Ether, Bisphenol A, C18-Unsaturated, Dimers, Epoxy Resin, Fatty Acids, Reaction Products with Polyethylenepolyamines, Triethylenetetramine - -
RS stock no. 448-0286
Mfr. Part No.740010410
R 638.16
Each
units
AS1701 Silicone Cartridge 75 ml Electrical Resistance 24 h 52 Shore A 0.6W/mK Black +220°C -50°C - - -
RS stock no. 915-9729
Mfr. Part No.Re-enterable Scotchcast Resin 8882 90ml
Brand3M
R 362.54
Each
units
Scotchcast 8882 - - - - - - - Transparent - - - - -
RS stock no. 199-1468
BrandRS PRO
R 484.42
Each
units
- Epoxy Pack 500 g - 24 → 48 h 80 Shore D - Amber +120°C -40°C Epoxy Resin 12kV/mm -
RS stock no. 199-1418
BrandRS PRO
R 153.56
Each
units
- Epoxy Pack 100 g Flame Retardant 24 h 85 Shore D 0.45W/mK Black +120°C -40°C Epoxy Resin, Formaldehyde, Neodecanoic Acid Glycidyl Ester, Polymer with 1, 3 Dimethylbenzene 16.6kV/mm Characteristic
RS stock no. 166-844
Mfr. Part No.UR5097RP250G
R 445.66
Each
units
UR5097 PUR Pack 250 g Encapsulating Compound, Flame Retardant, Thermal Conductivity 24 h 85 Shore A 0.65W/mK Black +110°C -40°C - - -
RS stock no. 160-8497
Mfr. Part No.UR5528RP250
R 468.59
Each
units
UR5528 PUR Pack 250 g - 24 h 57 Shore D 0.245W/mK Black +125°C -50°C - - -
RS stock no. 199-1452
BrandRS PRO
R 619.47
Each
units
- Epoxy Pack 1000 g Flame Retardant 24 h 85 Shore D 0.45W/mK Black +120°C -40°C Epoxy Resin, Formaldehyde, Neodecanoic Acid Glycidyl Ester, Polymer with 1, 3 Dimethylbenzene 16.6kV/mm Characteristic
RS stock no. 121-3879
Mfr. Part No.WATT
BrandRaytech
R 176.80
1 Set
Set(s)
- - Blister 30 x 38 x 26 mm - - - - Transparent +90°C - - - -
RS stock no. 195-978
BrandRS PRO
R 340.53
Each
units
- PUR Pack 250 g Low Penetrating Viscosity 24 h 12 Shore A 0.2W/mK Transparent Yellow +100°C -60°C Diphenylmethane-4, 4'-Di-Isocyanate 18kV/mm -