MG Chemicals 832B-3L Black Epoxy Epoxy Resin Adhesive 2.55 L

RS stock no.:: 918-4983
Mfr. Part No.:: 832B-3L
Manufacturer:: MG Chemicals

MG Chemicals 832B-3L Black Epoxy Epoxy Resin Adhesive 2.55 L

Bulk discount available

Subtotal (1 unit)*

R 4 273,14

(exc. VAT)

R 4 914,11

(inc. VAT)

FREE delivery for orders over R 1,500.00

In Stock

3 unit(s) ready to ship from another location
Plus 3 unit(s) shipping from 02 April 2026

Need more? Click ‘Check delivery dates’ to find extra stock and lead times.

Units	Per unit
1 - 14	R 4,273.14
15 - 39	R 4,166.31
40 +	R 4,041.32

*price indicative

RS stock no.:: 918-4983
Mfr. Part No.:: 832B-3L
Manufacturer:: MG Chemicals

Specification

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	MG Chemicals
	Product Material	Epoxy
	Package Type	Can
	Package Size	2.55 L
	Cure Time	35 min → 24 h
	Colour	Black
	Maximum Operating Temperature	+145°C
	Minimum Operating Temperature	-30°C
	Viscosity Measurement	3300cP/s
	Operating Temperature Range	-30 → +145 °C
	Physical Form	Liquid
	Chemical Composition	Acetone, Ethyl Lactate, Hydrocloric Acid, Isohexanes, Isopropyl Alcohol, Mineral Spirits, Water, Xylene
	Setting Time	60min

	Select all
	Brand MG Chemicals
	Product Material Epoxy
	Package Type Can
	Package Size 2.55 L
	Cure Time 35 min → 24 h
	Colour Black
	Maximum Operating Temperature +145°C
	Minimum Operating Temperature -30°C
	Viscosity Measurement 3300cP/s
	Operating Temperature Range -30 → +145 °C
	Physical Form Liquid
	Chemical Composition Acetone, Ethyl Lactate, Hydrocloric Acid, Isohexanes, Isopropyl Alcohol, Mineral Spirits, Water, Xylene
	Setting Time 60min

COO (Country of Origin):: CA

MG Chemicals Epoxy Potting Compounds

The MG Chemicals two-part epoxy potting compound has been designed to protect your electronic components. The liquid electric grade 832 series epoxy protects your components against static discharges, fungus, thermal shocks, mechanical impact and vibrations.

Feature and Benefits

Impact resistant

Non-conductive

Low toxicity

Improves reliability and operational range

Non-porous, water and chemical resistant

Hard to remove

Available in different colours

Typical Applications

Aviation Industry

Communication Industry

Marine Industry

Car industry

Potting Compounds

The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack.

Note

Refer to the datasheet for more details on how to apply and applications

Caution

Due to exothermic reaction, heat cure temperatures should be at least 25% below the maximum temperature tolerated by the most fragile PCB component. For larger potting blocks, reduce heat cure temperature by greater margins