Infineon 600 V 8 A Rectifier & Schottky Diode PG-TO252-3 IDD08SG60CXTMA2
- RS stock no.:
- 258-0956
- Mfr. Part No.:
- IDD08SG60CXTMA2
- Manufacturer:
- Infineon
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View bulk pricing optionsSubtotal (1 unit)*
R 105,85
(exc. VAT)
R 121,73
(inc. VAT)
FREE delivery for orders over R 1,500.00
In Stock
- 2,482 unit(s) ready to ship from another location
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Units | Per unit |
|---|---|
| 1 - 9 | R 105.85 |
| 10 - 99 | R 103.20 |
| 100 - 249 | R 100.10 |
| 250 - 499 | R 96.10 |
| 500 + | R 92.26 |
*price indicative
- RS stock no.:
- 258-0956
- Mfr. Part No.:
- IDD08SG60CXTMA2
- Manufacturer:
- Infineon
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | Rectifier & Schottky Diode | |
| Mount Type | Surface | |
| Package Type | PG-TO252-3 | |
| Maximum Continuous Forward Current If | 8A | |
| Peak Reverse Repetitive Voltage Vrrm | 600V | |
| Series | IDD08SG60C | |
| Peak Reverse Current Ir | 700μA | |
| Maximum Forward Voltage Vf | 2.2V | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | JEDEC1) | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type Rectifier & Schottky Diode | ||
Mount Type Surface | ||
Package Type PG-TO252-3 | ||
Maximum Continuous Forward Current If 8A | ||
Peak Reverse Repetitive Voltage Vrrm 600V | ||
Series IDD08SG60C | ||
Peak Reverse Current Ir 700μA | ||
Maximum Forward Voltage Vf 2.2V | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals JEDEC1) | ||
Automotive Standard No | ||
The Infineon CoolSiC Schottky diodes 600V G3 feature the industry's lowest device capacitance for any given current rating, which further enhances overall system efficiency, especially at higher switching frequencies and under low load conditions. The generation 3 is based on the same technology platform as generation 2 with the introduction, at package level, of the so called diffusion soldering.
Benchmark switching behaviour
No reverse recovery charge
Reduced cooling requirements
Enabling higher frequency/increased power density
Related links
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