RS PRO Grey PUR Potting Compound 500 g

From RS PRO a high-quality flame retardant, semi-rigid, low viscosity polyurethane resin potting compound designed to encapsulate and provide protection to your more delicate electronic components. This potting compound, due to the flexibility it has in its dried state, is especially suited for encapsulation in cable joining applications. The components that go to make up this potting compound are supplied in convenient two-component packs, one containing the polyurethane resin and the other containing the hardener. The contents are mixed together without opening the bag, simply remove the central clip and mix!

Polyurethane potting compound is a type of semi-rigid electronic potting compound used for potting PCBs (Printed Circuit Boards), electronics components and cable joints. Potting is a process of filling a complete electronic assembly with a solid or gelatinous compound. The potting compound, once applied, cured and hardened encases your electronics in a solid mass. This semi-rigid mass acts as a barrier which provides your components with electrical insulation and protection from water. The protection offered by this potting compound will enhance your products performance and will continue to do so even through extensive thermal cycling (the alternate heating and cooling of a material)

• Semi-rigid system
• Excellent water resistance
• Excellent electrical insulation properties
• Flame retardant to UL94 V-2
• Wide operating temperature range of -40 to +110°C
• Good thermal cycling protection
• ’Mix in the bag’ twin pack design reduces user contact and mess

This flexible potting compound is designed for potting circuits that contain delicate electrical components such as ferrites or glass reed switches. This potting compound is also used for encapsulation in cable jointing applications.

This potting compound is supplied in a two-part, twin pack format. One pack contains the polyurethane resin and the other contains the hardener both measured to the correct mix ratio. The two compartments are separated by a clip, which, when removed, forms one bag allowing you to mix the contents together. This design prevents air entrapment and allows the resin to be applied without any direct user contact avoiding excessive handling and mess. Each twin pack is supplied with full instructions for use. All packs are supplied with a desiccant for storage.

Before applying this potting compound it is important that any residue or contaminants are removed from the electronic components prior to potting. The electronic assembly is placed inside a mould called ’The pot’. This mould is then filled with the mixed potting compound that hardens and permanently protects the assembly. Circuit boards can also be potted and are often called ’potted’ PCBs. These circuit boards have high walled sides forming an enclosure with the mounted electronic components sitting inside. The potting compound is then poured into this enclosure.

Potting Compounds: Twin Packs