Samtec ASP Series Straight Surface PCB Socket, 50-Contact, 2 Row, 0.8 mm Pitch Solder
- RS stock no.:
- 180-2773
- Mfr. Part No.:
- ASP-148422-01
- Manufacturer:
- Samtec
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Bulk discount available
Subtotal (1 unit)*
R 141,90
(exc. VAT)
R 163,18
(inc. VAT)
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Units | Per unit |
|---|---|
| 1 - 24 | R 141.90 |
| 25 - 99 | R 138.35 |
| 100 - 249 | R 134.20 |
| 250 - 499 | R 128.83 |
| 500 + | R 123.68 |
*price indicative
- RS stock no.:
- 180-2773
- Mfr. Part No.:
- ASP-148422-01
- Manufacturer:
- Samtec
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Number of Contacts | 50 | |
| Product Type | PCB Socket | |
| Number of Rows | 2 | |
| Sub Type | Socket Assembly | |
| Pitch | 0.8mm | |
| Current | 2.7A | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Stacking Height | 22mm | |
| Connector System | Board-to-Board | |
| Voltage | 339V | |
| Series | ASP | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 3.36mm | |
| Contact Gender | Female | |
| Contact Plating | Gold over Nickel | |
| Contact Material | Beryllium Copper Alloy | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Number of Contacts 50 | ||
Product Type PCB Socket | ||
Number of Rows 2 | ||
Sub Type Socket Assembly | ||
Pitch 0.8mm | ||
Current 2.7A | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Stacking Height 22mm | ||
Connector System Board-to-Board | ||
Voltage 339V | ||
Series ASP | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 3.36mm | ||
Contact Gender Female | ||
Contact Plating Gold over Nickel | ||
Contact Material Beryllium Copper Alloy | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals RoHS | ||
The Samtec PCB Socket ASP series is a surface mount PCB socket. As advances in semiconductor and system design continue, embedded applications are using higher performance embedded processors. Efficient use of these embedded processors requires software and hardware development tools that can easily access critical processor functionality.
Contact Plating: Gold over Nickel
Contact Material: Beryllium Copper
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