Samtec ASP Series Straight Surface PCB Socket, 50-Contact, 2 Row, 0.8 mm Pitch Solder
- RS stock no.:
- 180-2773
- Mfr. Part No.:
- ASP-148422-01
- Manufacturer:
- Samtec
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Subtotal (1 unit)*
R 139,98
(exc. VAT)
R 160,98
(inc. VAT)
FREE delivery for orders over R 1,500.00
Temporarily out of stock
- Shipping from 18 May 2026
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Units | Per unit |
|---|---|
| 1 - 24 | R 139.98 |
| 25 - 99 | R 136.48 |
| 100 - 249 | R 132.39 |
| 250 - 499 | R 127.09 |
| 500 + | R 122.01 |
*price indicative
- RS stock no.:
- 180-2773
- Mfr. Part No.:
- ASP-148422-01
- Manufacturer:
- Samtec
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Number of Contacts | 50 | |
| Product Type | PCB Socket | |
| Number of Rows | 2 | |
| Sub Type | Socket Assembly | |
| Pitch | 0.8mm | |
| Current | 2.7A | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Stacking Height | 22mm | |
| Connector System | Board-to-Board | |
| Series | ASP | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 3.36mm | |
| Contact Gender | Female | |
| Contact Material | Beryllium Copper Alloy | |
| Maximum Operating Temperature | 125°C | |
| Contact Plating | Gold over Nickel | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Number of Contacts 50 | ||
Product Type PCB Socket | ||
Number of Rows 2 | ||
Sub Type Socket Assembly | ||
Pitch 0.8mm | ||
Current 2.7A | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Stacking Height 22mm | ||
Connector System Board-to-Board | ||
Series ASP | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 3.36mm | ||
Contact Gender Female | ||
Contact Material Beryllium Copper Alloy | ||
Maximum Operating Temperature 125°C | ||
Contact Plating Gold over Nickel | ||
Standards/Approvals RoHS | ||
The Samtec PCB Socket ASP series is a surface mount PCB socket. As advances in semiconductor and system design continue, embedded applications are using higher performance embedded processors. Efficient use of these embedded processors requires software and hardware development tools that can easily access critical processor functionality.
Contact Plating: Gold over Nickel
Contact Material: Beryllium Copper
Related links
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