Samtec ASP Series Straight Surface PCB Socket, 50-Contact, 2 Row, 0.8 mm Pitch Solder
- RS stock no.:
- 180-2773
- Mfr. Part No.:
- ASP-148422-01
- Manufacturer:
- Samtec
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Subtotal (1 unit)*
R 142,14
(exc. VAT)
R 163,46
(inc. VAT)
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Temporarily out of stock
- Shipping from 23 March 2026
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Units | Per unit |
|---|---|
| 1 - 24 | R 142.14 |
| 25 - 99 | R 138.59 |
| 100 - 249 | R 134.43 |
| 250 - 499 | R 129.05 |
| 500 + | R 123.89 |
*price indicative
- RS stock no.:
- 180-2773
- Mfr. Part No.:
- ASP-148422-01
- Manufacturer:
- Samtec
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Number of Contacts | 50 | |
| Product Type | PCB Socket | |
| Sub Type | Socket Assembly | |
| Number of Rows | 2 | |
| Pitch | 0.8mm | |
| Current | 2.7A | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Stacking Height | 22mm | |
| Voltage | 339 V | |
| Series | ASP | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 3.36mm | |
| Contact Gender | Female | |
| Contact Plating | Gold over Nickel | |
| Maximum Operating Temperature | 125°C | |
| Contact Material | Beryllium Copper Alloy | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Number of Contacts 50 | ||
Product Type PCB Socket | ||
Sub Type Socket Assembly | ||
Number of Rows 2 | ||
Pitch 0.8mm | ||
Current 2.7A | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Stacking Height 22mm | ||
Voltage 339 V | ||
Series ASP | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 3.36mm | ||
Contact Gender Female | ||
Contact Plating Gold over Nickel | ||
Maximum Operating Temperature 125°C | ||
Contact Material Beryllium Copper Alloy | ||
Standards/Approvals RoHS | ||
The Samtec PCB Socket ASP series is a surface mount PCB socket. As advances in semiconductor and system design continue, embedded applications are using higher performance embedded processors. Efficient use of these embedded processors requires software and hardware development tools that can easily access critical processor functionality.
Contact Plating: Gold over Nickel
Contact Material: Beryllium Copper
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