Samtec ASP Series Straight Surface PCB Socket, 50-Contact, 2 Row, 0.8 mm Pitch Solder
- RS stock no.:
- 180-2492
- Mfr. Part No.:
- ASP-148422-01
- Manufacturer:
- Samtec
Image representative of range
Subtotal (1 pack of 375 units)*
R 45 540,00
(exc. VAT)
R 52 372,50
(inc. VAT)
Stock information currently inaccessible - Please check back later
Units | Per unit | Per Pack* |
|---|---|---|
| 375 + | R 121.44 | R 45,540.00 |
*price indicative
- RS stock no.:
- 180-2492
- Mfr. Part No.:
- ASP-148422-01
- Manufacturer:
- Samtec
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 50 | |
| Number of Rows | 2 | |
| Sub Type | Socket Assembly | |
| Pitch | 0.8mm | |
| Current | 2.7A | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Stacking Height | 22mm | |
| Connector System | Board-to-Board | |
| Voltage | 339V | |
| Series | ASP | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 3.36mm | |
| Contact Material | Beryllium Copper Alloy | |
| Contact Plating | Gold over Nickel | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Female | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 50 | ||
Number of Rows 2 | ||
Sub Type Socket Assembly | ||
Pitch 0.8mm | ||
Current 2.7A | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Stacking Height 22mm | ||
Connector System Board-to-Board | ||
Voltage 339V | ||
Series ASP | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 3.36mm | ||
Contact Material Beryllium Copper Alloy | ||
Contact Plating Gold over Nickel | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Female | ||
Standards/Approvals RoHS | ||
The Samtec PCB Socket ASP series is a surface mount PCB socket. As advances in semiconductor and system design continue, embedded applications are using higher performance embedded processors. Efficient use of these embedded processors requires software and hardware development tools that can easily access critical processor functionality.
Contact Plating: Gold over Nickel
Contact Material: Beryllium Copper
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