Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx15, xx16 and xx17 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• PCB polarising pegs for alignment and positioning on PCB

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals

This PCB header facilitates a dependable connection for wire-to-board applications, tailored for high-current situations. The Micro-Fit 3.0 structure features a shrouded design that improves the connector's compatibility and operational stability. With a current rating of 8.5A and a voltage rating of 600V, it meets the requirements of the automation, electronics, and electrical sectors.

• Tin plating provides corrosion resistance and conductivity
• Glow wire compliant for safety in elevated temperature environments
• High durability with 30 mating cycles for extended use

• Utilised in power distribution and control systems
• Suitable for automation equipment needing compact connectors
• Ideal for electronic devices requiring secure wire-to-board connections

The optimal PCB thickness for this connector is 1.60mm, ensuring effective retention and stability during operation.

Yes, it can handle a maximum process temperature of 260°C for up to 30 seconds, making it suitable for lead-free solder processes.

This header supports up to 4 circuits, offering flexibility for various power and signal connection requirements.

Yes, with a maximum current rating of 8.5A per contact, it is appropriate for high-current PCB connections.

Molex Micro-Fit 3.0 Series