Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 2 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• Plastic peg PCB locks for secure connection to PCB
• Glow Wire Compliant

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals

Keen to connect your components in a flash? Choose this two-way PCB header from Molex to link accessories such as sensors, displays or communication devices to your board. A locking ramp ensures modules are attached securely and there's no risk of accidental detachment that could cause a glitch in your system. Flame-retardant liquid crystal polymer housing means this unit can handle extreme temperatures of up to +265°C during IR reflow soldering without breaking a sweat.

• Brass contacts resist corrosion and wear to deliver long-term service
• Plastic peg PCB locks make installation speedy
• 5A current rating ensures seamless compatibility with standard components

• Renewable energy generation
• Transportation systems
• Consumer electronics

Installation is a matter of just slotting the header's pins through corresponding holes on your board and soldering them in place.

Molex Micro-Fit 3.0 Series