Phoenix Contact MCDNV Series Solder PCB Header, 18 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded
- RS stock no.:
- 557-126
- Mfr. Part No.:
- 1952856
- Manufacturer:
- Phoenix Contact
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- RS stock no.:
- 557-126
- Mfr. Part No.:
- 1952856
- Manufacturer:
- Phoenix Contact
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Phoenix Contact | |
| Series | MCDNV | |
| Product Type | PCB Header | |
| Current | 8A | |
| Pitch | 3.5mm | |
| Number of Contacts | 18 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 2 | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | COMBICON FMC 1.5 MCDN 1.5 | |
| Mount Type | Solder | |
| Contact Plating | Tin | |
| Contact Material | Copper Alloy | |
| Row Pitch | 3.5mm | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Solder | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 100°C | |
| Tail Pin Length | 2.6mm | |
| Mating Pin Length | 26mm | |
| Standards/Approvals | cULus Recognised, VDE | |
| Voltage | 160 V | |
| Select all | ||
|---|---|---|
Brand Phoenix Contact | ||
Series MCDNV | ||
Product Type PCB Header | ||
Current 8A | ||
Pitch 3.5mm | ||
Number of Contacts 18 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 2 | ||
Shrouded/Unshrouded Shrouded | ||
Connector System COMBICON FMC 1.5 MCDN 1.5 | ||
Mount Type Solder | ||
Contact Plating Tin | ||
Contact Material Copper Alloy | ||
Row Pitch 3.5mm | ||
Minimum Operating Temperature -40°C | ||
Termination Type Solder | ||
Contact Gender Male | ||
Maximum Operating Temperature 100°C | ||
Tail Pin Length 2.6mm | ||
Mating Pin Length 26mm | ||
Standards/Approvals cULus Recognised, VDE | ||
Voltage 160 V | ||
- COO (Country of Origin):
- DE
The Phoenix Contact PCB Header is part of the COMBICON Connectors S product line and is suitable for through-hole reflow. The mounting type supports both THR soldering and wave soldering. The pin layout is linear pinning, with contacts MADE from copper alloy. The surface is tin-plated, and the insulating material is LCP (Liquid Crystal Polymer).
Designed for integration into the SMT soldering process
Vertical connection enables multi row arrangement on the PCB
Maximum flexibility when it comes to device design which is one header for connectors with different connection technologies
Conductor connection on several levels enables higher contact density
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