Vishay SISS32LDN Type N-Channel Single MOSFETs, 63 A, 80 V Enhancement, 8-Pin PowerPAK

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R 24,39

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R 28,05

(inc. VAT)

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100 - 499R 23.07
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RS stock no.:
653-104
Mfr. Part No.:
SISS32LDN-T1-BE3
Manufacturer:
Vishay
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Brand

Vishay

Product Type

Single MOSFETs

Channel Type

Type N

Maximum Continuous Drain Current Id

63A

Maximum Drain Source Voltage Vds

80V

Package Type

PowerPAK

Series

SISS32LDN

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

0.0072Ω

Channel Mode

Enhancement

Maximum Gate Source Voltage Vgs

20V

Typical Gate Charge Qg @ Vgs

17.7nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

65.7W

Forward Voltage Vf

1.1V

Maximum Operating Temperature

150°C

Height

0.75mm

Length

3.3mm

Standards/Approvals

RoHS

Width

3.3mm

Automotive Standard

No

COO (Country of Origin):
TH

Vishay SISS32LDN Series Single MOSFETs, 80V Maximum Drain Source Voltage, 63A Maximum Continuous Drain Current - SISS32LDN-T1-BE3


This single MOSFETs device is a high-current N-channel transistor designed for surface-mount power switching in industrial electronics. It operates as an enhancement-mode MOSFET suitable for driving and switching applications where elevated drain-source voltage and robust current handling are required. The component is supplied in a Compact PowerPAK package intended for SMD assembly and complies with RoHS requirements.

Features and Benefits:


• 80V drain-source rating enables high-voltage switching capability • 63A continuous drain current supports heavy-load conduction • Low RDS(on) 0.0072Ω minimises conduction losses under load • 65.7W power dissipation allows sustained thermal throughput • 17.7nC typical gate charge affords controlled switching energy • 150°C maximum operating temperature permits high-temperature operation

Applications


• Suitable for motor-drive half-bridge stages in automation systems • Ideal for DC-DC converters in power distribution modules • Used for load switching in industrial control equipment • Can be used for battery management and high-current distribution

What gate-voltage limits should designers observe?


The gate-to-source voltage must not exceed ±20V to prevent gate-dielectric stress.

What thermal considerations apply during PCB layout?


Given the 65.7W dissipation rating, designers should provide adequate copper area and thermal vias for heat spreading and connect to a heatsinking plane where necessary.

How does switching behaviour impact electromagnetic emissions?


The 17.7nC gate charge influences rise and fall times

controlling gate-drive slew rates and adding snubbers helps manage switching transients and EMI.

What ambient extremes can the device tolerate during operation?


It is specified for use down to -55°C and up to 150°C junction temperature for broad environmental range compatibility.

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