Infineon FF1800R17IP5BPSA1 Dual IGBT, 1.8 kA 1700 V AG-PRIME3+
- RS stock no.:
- 222-4792
- Mfr. Part No.:
- FF1800R17IP5BPSA1
- Manufacturer:
- Infineon
Bulk discount available
Subtotal (1 unit)*
R 16 533,79
(exc. VAT)
R 19 013,86
(inc. VAT)
FREE delivery for orders over R 1,500.00
In Stock
- 4 unit(s) ready to ship from another location
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Units | Per unit |
|---|---|
| 1 - 9 | R 16,533.79 |
| 10 - 99 | R 16,120.45 |
| 100 - 249 | R 15,636.84 |
| 250 - 499 | R 15,011.37 |
| 500 + | R 14,410.92 |
*price indicative
- RS stock no.:
- 222-4792
- Mfr. Part No.:
- FF1800R17IP5BPSA1
- Manufacturer:
- Infineon
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Maximum Continuous Collector Current | 1.8 kA | |
| Maximum Collector Emitter Voltage | 1700 V | |
| Maximum Gate Emitter Voltage | 20V | |
| Maximum Power Dissipation | 1.8 kW | |
| Configuration | Dual | |
| Package Type | AG-PRIME3+ | |
| Channel Type | N | |
| Transistor Configuration | Common Emitter | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Maximum Continuous Collector Current 1.8 kA | ||
Maximum Collector Emitter Voltage 1700 V | ||
Maximum Gate Emitter Voltage 20V | ||
Maximum Power Dissipation 1.8 kW | ||
Configuration Dual | ||
Package Type AG-PRIME3+ | ||
Channel Type N | ||
Transistor Configuration Common Emitter | ||
The Infineon PrimePACK™3+ 1700 V, 1800 A dual IGBT module with TRENCHSTOP™ IGBT5 and .XT soft switching interconnection technology, Emitter Controlled 5 diode and NTC. Also available with pre-applied Thermal Interface Material.
Extended operation temperature (Tvjop= 175°C)
Output current increased by more than 25% in the same footprint
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Total losses reduced by up to 20%
Package with CTI > 400
Output current increased by more than 25% in the same footprint
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Total losses reduced by up to 20%
Package with CTI > 400
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