Fischer Elektronik Heatsink, Universal Square Alu, 13.8K/W 10 mm 40 mm 40mm
- RS stock no.:
- 674-4769
- Mfr. Part No.:
- ICK BGA 40x40x10
- Manufacturer:
- Fischer Elektronik
Bulk discount available
View bulk pricing optionsSubtotal (1 unit)*
R 92,45
(exc. VAT)
R 106,32
(inc. VAT)
FREE delivery for orders over R 1,500.00
Limited stock
- Plus 484 left, shipping from 12 October 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 9 | R 92.45 |
| 10 - 49 | R 90.14 |
| 50 - 99 | R 87.44 |
| 100 - 249 | R 83.94 |
| 250 + | R 80.58 |
*price indicative
- RS stock no.:
- 674-4769
- Mfr. Part No.:
- ICK BGA 40x40x10
- Manufacturer:
- Fischer Elektronik
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Fischer Elektronik | |
| Product Type | Heatsink | |
| For Use With | Universal Square Alu | |
| Length | 40mm | |
| Width | 40mm | |
| Height | 10mm | |
| Fastening | Clamp, Conductive Adhesive, Screw, Thermally conductive adhesive | |
| Thermal Resistance | 13.8K/W | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | BGA | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | Power PC, Cooler, PLCC, Semiconductor, Ic Processors, Fan, Thermal, Microprocessor, SMD, Pin Heat Sinks, PGA, Heat Sink For IC, Bga | |
| Select all | ||
|---|---|---|
Brand Fischer Elektronik | ||
Product Type Heatsink | ||
For Use With Universal Square Alu | ||
Length 40mm | ||
Width 40mm | ||
Height 10mm | ||
Fastening Clamp, Conductive Adhesive, Screw, Thermally conductive adhesive | ||
Thermal Resistance 13.8K/W | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type BGA | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application Power PC, Cooler, PLCC, Semiconductor, Ic Processors, Fan, Thermal, Microprocessor, SMD, Pin Heat Sinks, PGA, Heat Sink For IC, Bga | ||
- COO (Country of Origin):
- DE
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
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