Fischer Elektronik Heatsink, Universal Square Alu 22 mm 27 mm 27 mm
- RS stock no.:
- 674-4753
- Mfr. Part No.:
- ICK BGA 27x27x22
- Manufacturer:
- Fischer Elektronik
Bulk discount available
Subtotal (1 unit)*
R 245,17
(exc. VAT)
R 281,95
(inc. VAT)
FREE delivery for orders over R 1,500.00
In Stock
- 64 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 9 | R 245.17 |
| 10 - 49 | R 239.04 |
| 50 - 99 | R 231.87 |
| 100 - 249 | R 222.60 |
| 250 + | R 213.70 |
*price indicative
- RS stock no.:
- 674-4753
- Mfr. Part No.:
- ICK BGA 27x27x22
- Manufacturer:
- Fischer Elektronik
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 27mm | |
| Height | 22mm | |
| Fastening | Clamp, Conductive Adhesive, Glue, Integrated clamp, Screw, Thermally conductive adhesive | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | PGA, PLCC, LED, DIL/IC, BGA, SMD | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | SMD, Heat Sink For IC, Bga, Fan, PLCC, Ic Processors, Power PC, Microprocessor, Cooler, PGA | |
| Select all | ||
|---|---|---|
Brand Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 27mm | ||
Height 22mm | ||
Fastening Clamp, Conductive Adhesive, Glue, Integrated clamp, Screw, Thermally conductive adhesive | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type PGA, PLCC, LED, DIL/IC, BGA, SMD | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application SMD, Heat Sink For IC, Bga, Fan, PLCC, Ic Processors, Power PC, Microprocessor, Cooler, PGA | ||
- COO (Country of Origin):
- DE
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
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