onsemi ESD5581N2T5G 1-Element Bi-Directional TVS Diode, 250 mW, 2-Pin X2-DFN
- RS stock no.:
- 185-9076
- Mfr. Part No.:
- ESD5581N2T5G
- Manufacturer:
- onsemi
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- RS stock no.:
- 185-9076
- Mfr. Part No.:
- ESD5581N2T5G
- Manufacturer:
- onsemi
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | onsemi | |
| Product Type | TVS Diode | |
| Direction Type | Bi-Directional | |
| Diode Configuration | Single | |
| Minimum Breakdown Voltage Vbr | 5.2V | |
| Mount Type | Surface | |
| Package Type | X2-DFN | |
| Maximum Reverse Stand-off Voltage Vwm | 5V | |
| Pin Count | 2 | |
| Peak Pulse Power Dissipation Pppm | 250mW | |
| Minimum Operating Temperature | -55°C | |
| Clamping Voltage VC | 12V | |
| Test Current It | 1mA | |
| ESD Protection | Yes | |
| Maximum Peak Pulse Current Ippm | 6A | |
| Maximum Operating Temperature | 150°C | |
| Number of Elements per Chip | 1 | |
| Height | 0.28mm | |
| Width | 0.36mm | |
| Standards/Approvals | No | |
| Length | 0.66mm | |
| Automotive Standard | No | |
| Maximum Reverse Leakage Current | 100nA | |
| Select all | ||
|---|---|---|
Brand onsemi | ||
Product Type TVS Diode | ||
Direction Type Bi-Directional | ||
Diode Configuration Single | ||
Minimum Breakdown Voltage Vbr 5.2V | ||
Mount Type Surface | ||
Package Type X2-DFN | ||
Maximum Reverse Stand-off Voltage Vwm 5V | ||
Pin Count 2 | ||
Peak Pulse Power Dissipation Pppm 250mW | ||
Minimum Operating Temperature -55°C | ||
Clamping Voltage VC 12V | ||
Test Current It 1mA | ||
ESD Protection Yes | ||
Maximum Peak Pulse Current Ippm 6A | ||
Maximum Operating Temperature 150°C | ||
Number of Elements per Chip 1 | ||
Height 0.28mm | ||
Width 0.36mm | ||
Standards/Approvals No | ||
Length 0.66mm | ||
Automotive Standard No | ||
Maximum Reverse Leakage Current 100nA | ||
- COO (Country of Origin):
- CN
The ESD5581 is designed to protect voltage sensitive components that require low capacitance from ESD events. Excellent clamping capability, low capacitance, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its low capacitance, the part is well suited for use in high frequency designs such as USB 2.0 high speed applications.
Low Capacitance, 5.0 μF (Max)
Low Clamping Voltage, 10 V
Small Body Outline Dimensions, 0.62 mm x 0.32 mm
Low Body Height, 0.3 mm
Stand−off Voltage, 5 V
Applications
USB ID
GPIO
μSD Protection
End Products
Flash Drives
HDD
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