Bergquist TGP 3000 Series Self-Adhesive Thermal Gap Pad, 0.01in Thick, 3W/m·K, Silicone, 16 x 8 x 0.01in

The Bergquist Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material. It is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due to an all new 3 W/m-K filler package and low-modulus resin formulation. It is reinforced to enhance material handling, puncture, shear and tear resistance. It is well suited for high performance, low-stress applications that typically use fixed standoff or clip mounting. It maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and or topography.

Highly conformable
Designed for low-stress applications