Bergquist TGP 1300 Series Self-Adhesive Thermal Gap Pad, 0.08in Thick, 1.3W/m·K, Silicone, 16 x 8 x 0.08in

The Bergquist Highly Conformable, Thermally Conductive, Reinforced S-Class Gap Filling Material. It is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling characteristics. It maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and or topography. BERGQUIST GAP PAD TGP 1300 features an inherent tack on both sides of the material.

Highly Conformable
Low hardness
Decreased strain on fragile components
Fiberglass reinforced for puncture, shear and tear resistance
Quick rebound to original shape