Molex Pluggable I/O Connector QSFP I/O Connector Female Piercing 2 Port 152-Position, 204058-6101
- RS stock no.:
- 683-482
- Mfr. Part No.:
- 204058-6101
- Manufacturer:
- Molex
Subtotal (1 tray of 3 units)*
R 4 428,26
(exc. VAT)
R 5 092,50
(inc. VAT)
FREE delivery for orders over R 1,500.00
Stocked by manufacturer
- Ready to ship from 26 May 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tray(s) | Per Tray | Per unit* |
|---|---|---|
| 1 + | R 4,428.26 | R 1,476.087 |
*price indicative
- RS stock no.:
- 683-482
- Mfr. Part No.:
- 204058-6101
- Manufacturer:
- Molex
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Product Type | Pluggable I/O Connector | |
| Termination Type | Piercing | |
| Form Factor | QSFP | |
| Sub Type | I/O Connector | |
| Number of Ports | 2 | |
| Current | 0.5A | |
| Number of Contacts | 152 | |
| Orientation | Right Angle | |
| Contact Material | Copper Alloy | |
| Connector Gender | Female | |
| Contact Plating | Gold, Matte Tin | |
| Housing Material | Copper Alloy | |
| Series | 204058 | |
| Contact Gender | Female | |
| Standards/Approvals | IPC 1752A Class C & D, UL Certification: E29179, REACH, RoHS, IEC-62474, CHINA RoHS | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Product Type Pluggable I/O Connector | ||
Termination Type Piercing | ||
Form Factor QSFP | ||
Sub Type I/O Connector | ||
Number of Ports 2 | ||
Current 0.5A | ||
Number of Contacts 152 | ||
Orientation Right Angle | ||
Contact Material Copper Alloy | ||
Connector Gender Female | ||
Contact Plating Gold, Matte Tin | ||
Housing Material Copper Alloy | ||
Series 204058 | ||
Contact Gender Female | ||
Standards/Approvals IPC 1752A Class C & D, UL Certification: E29179, REACH, RoHS, IEC-62474, CHINA RoHS | ||
- COO (Country of Origin):
- CN
The Molex QSFP-DD Assembly is an innovative interconnect solution designed for high-density data applications. Featuring a stacked 2x1 design and a 4.50mm fin heat sink this assembly ensures optimal thermal performance and reliability. With a robust construction tailored for module to board applications this product supports substantial data throughput while adhering to stringent compliance standards such as EU RoHS and Halogen-Free. The assembly is specially designed for environments where thermal efficiency and durability are paramount making it an ideal choice for advanced network communications and data centre deployments.
Supports a maximum of 152 loaded circuits which ensuring high data capacity
Constructed from durable materials like high-temperature thermoplastic and copper alloy
Features a right-angle orientation for flexible installation options
Durability tested for up to 100 mating cycles guaranteeing long-lasting performance
Low-halogen content complying with environmental safety standards
Integration with various tooling for ease of installation and maintenance
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