Molex 46557 Series Vertical Surface Mount PCB Socket, 80-Contact, 4 Row, 1.27 mm Pitch Surface Mount

Subtotal (1 reel of 210 units)*

R 72 430,08

(exc. VAT)

R 83 294,59

(inc. VAT)

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  • Ready to ship from 03 July 2026
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Reel(s)
Per Reel
Per unit*
1 +R 72,430.08R 344.905

*price indicative

RS stock no.:
693-744
Mfr. Part No.:
46557-2545
Manufacturer:
Molex
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Brand

Molex

Product Type

PCB Socket

Number of Contacts

80

Number of Rows

4

Sub Type

Socket

Pitch

1.27mm

Current

2.7A

Termination Type

Surface Mount

Housing Material

High Temperature Thermoplastic

Mount Type

Surface Mount

Orientation

Vertical

Stacking Height

8mm

Connector System

Board-to-Board

Voltage

240V

Series

46557

Row Pitch

1.27mm

Minimum Operating Temperature

-55°C

Contact Plating

Gold

Maximum Operating Temperature

125°C

Contact Material

Copper Alloy

Standards/Approvals

UL E29179

COO (Country of Origin):
US
The Molex SEARAY Slim Receptacle is engineered for seamless board-to-board connectivity, boasting an innovative design tailored for high-performance applications. Featuring 80 circuits within a Compact 8.00mm unmated height and structured in four rows, this receptacle is Ideal for mezzanine and signal applications. Its lead-free solder charging ensures compliance with contemporary environmental standards, while the copper alloy construction with a gold-plated mating surface delivers reliable electrical performance. Designed with precision, it facilitates easy robotic placement and offers robustness in various operational conditions, making it a perfect choice for modern electronic assemblies.

80 circuits ensure ample connectivity options

8.00mm unmated height contributes to space-saving designs

Four-row configuration enhances signal integrity

Lead-free design aligns with environmental compliance requirements

Durable copper alloy construction offers long-lasting performance

Gold-plated mating surface reduces contact resistance

Designed for board-to-board and mezzanine applications, increasing versatility

Robotic placement compatibility simplifies assembly processes

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