TE Connectivity AMPMODU Series Vertical Board PCB Header, 80 Contact(s), 1.27 mm Pitch, 2 Row, Unshrouded

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Subtotal (1 tube of 9 units)*

R 4 422,75

(exc. VAT)

R 5 086,16

(inc. VAT)

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Tube(s)
Per Tube
Per unit*
1 +R 4,422.75R 491.417

*price indicative

RS stock no.:
480-365
Mfr. Part No.:
104550-8
Manufacturer:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3.6A

Pitch

1.27mm

Number of Contacts

80

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Minimum Operating Temperature

65°C

Row Pitch

1.27mm

Termination Type

Surface Mount

Maximum Operating Temperature

105°C

Contact Gender

Female

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

30 V

Distrelec Product Id

304-53-642

Non Compliant

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Receptacle is a sophisticated connector designed for vertical board-to-board applications, integrating advanced engineering within its 80-position layout. Precision-engineered for seamless performance, this receptacle features a 1.27 mm centreline, ensuring reliable connectivity across circuits. With a robust construction that includes gold plating and surface mount capabilities, it combines durability with optimal signal transmission. Its sleek black housing not only enhances aesthetic appeal but also ensures compatibility across various applications within the AMPMODU System 50 series. Whether used in industrial settings or consumer electronics, this receptacle delivers on both functionality and reliability, making it an essential component for any PCB design.

Designed for board to board configurations to facilitate effective connections

Robust retention features ensure secure mounting on the PCB

Operating temperature range accommodates diverse environmental conditions

Low halogen materials promote environmentally friendly usage

Optimised for reflow solder processes simplifying assembly requirements

PCB mount orientation maximises layout flexibility for various applications

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