TE Connectivity AMPMODU Series Vertical Board PCB Header, 6 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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Subtotal (1 reel of 100 units)*

R 5 208,27

(exc. VAT)

R 5 989,51

(inc. VAT)

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  • Shipping from 26 January 2026
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Reel(s)
Per Reel
Per unit*
1 +R 5,208.27R 52.083

*price indicative

RS stock no.:
479-476
Mfr. Part No.:
1825514-4
Manufacturer:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

6

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Tin Plated

Contact Material

Brass

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Termination Type

Surface Mount

Maximum Operating Temperature

105°C

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Distrelec Product Id

304-53-723

COO (Country of Origin):
MX
The TE Connectivity PCB mount header embodies the pinnacle of wire-to-board connectivity, designed for modern electronics. This vertical connector supports six positions with a convenient 2.54 mm centreline, ensuring seamless integration within compact PCBs. Fully shrouded for enhanced safety and reliability, it’s ideal for applications that demand high performance in signal processing. Crafted from robust thermoplastic, the housing withstands a broad operating temperature range of -65 to 105 °C, making it suitable for various environments. The innovative design features a square contact layout and latching for secure mating, ensuring stability during operation. With a tin-plated contact area, this component also promotes excellent electrical conductivity, making it a trustworthy choice for your projects.

Designed for vertical PCB mounting, optimising space utilisation

Fully shrouded design enhances electrical safety during usage

Accommodates six positions, offering versatile connection options

Tin-plated contact areas ensure superior conductivity and durability

Thermoplastic housing guarantees resilience against varied temperatures

Latch feature facilitates secure mating, preventing accidental disconnections

Compact dimensions cater to space-constrained applications

Compatible with a wide range of connector assemblies, enhancing system design flexibility

Ideal for signal applications, boosting performance in electronic configurations

Designed for reflow solder processes, streamlining assembly operations

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