Molex MicroClasp Series Straight Through Hole PCB Header, 2 Contact(s), 2 mm Pitch, 1 Row, Shrouded

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Subtotal (1 pack of 10 units)*

R 66,66

(exc. VAT)

R 76,66

(inc. VAT)

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In Stock
  • Plus 260 unit(s) shipping from 22 December 2025
  • Plus 7,080 unit(s) shipping from 29 December 2025
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Units
Per unit
Per Pack*
10 - 190R 6.666R 66.66
200 - 740R 6.499R 64.99
750 - 2990R 6.304R 63.04
3000 - 5990R 6.052R 60.52
6000 +R 5.81R 58.10

*price indicative

Packaging Options:
RS stock no.:
188-349
Mfr. Part No.:
55932-0210
Manufacturer:
Molex
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Brand

Molex

Product Type

PCB Header

Series

MicroClasp

Current

3A

Pitch

2mm

Housing Material

Polyester

Number of Contacts

2

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Plating

Tin

Contact Material

Tin

Termination Type

Solder

Row Pitch

2mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Contact Gender

Male

Tail Pin Length

3.2mm

Standards/Approvals

No

Mating Pin Length

2mm

Voltage

250 V

Distrelec Product Id

304-37-210

COO (Country of Origin):
JP

Single Row Vertical Header with Boss


A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.

2.0mm Wire to Board - Molex MicroClasp™ Range


MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The Terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a Compact 2.00mm pitch design.

2.00mm (0.079”) Pitch

Inner Positive Lock

Low insertion force Terminal design

Two-point contact design

High-current contact design

Housing lance system

PCB space savings

Latch protection/secure mating/audible “click”

Easy mating/unmating

Carry up to 3.0A

Terminal protection and secure retention

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