Infineon 3 Axis Surface Position Sensor 2.8 V 3.5V, I2C, TSOP, 6-Pin
- RS stock no.:
- 233-3501
- Mfr. Part No.:
- TLE493DP2B6A0HTSA1
- Manufacturer:
- Infineon
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Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS stock no.:
- 233-3501
- Mfr. Part No.:
- TLE493DP2B6A0HTSA1
- Manufacturer:
- Infineon
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Number of Axis | 3 | |
| Mount Type | Surface | |
| Product Type | Position Sensor | |
| Minimum Supply Voltage | 2.8 V | |
| Maximum Supply Voltage | 3.5 V | |
| Interface Type | I2C | |
| Package Type | TSOP | |
| Pin Count | 6 | |
| Automotive Standard | AEC-Q100 | |
| Height | 1.1 mm | |
| Length | 2.9 mm | |
| Maximum Frequency Response | 100 kHz | |
| Maximum Operating Temperature | 125 °C | |
| Minimum Frequency Response | 5.5 kHz | |
| Minimum Operating Temperature | -40 °C | |
| Sensor Type | Motion Sensor Module | |
| Series | TLE493D-P2B6 | |
| Standards/Approvals | No | |
| Supply Current | 3.4 mA | |
| Technology | Digital | |
| Width | 1.6 mm | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Number of Axis 3 | ||
Mount Type Surface | ||
Product Type Position Sensor | ||
Minimum Supply Voltage 2.8 V | ||
Maximum Supply Voltage 3.5 V | ||
Interface Type I2C | ||
Package Type TSOP | ||
Pin Count 6 | ||
Automotive Standard AEC-Q100 | ||
Height 1.1 mm | ||
Length 2.9 mm | ||
Maximum Frequency Response 100 kHz | ||
Maximum Operating Temperature 125 °C | ||
Minimum Frequency Response 5.5 kHz | ||
Minimum Operating Temperature -40 °C | ||
Sensor Type Motion Sensor Module | ||
Series TLE493D-P2B6 | ||
Standards/Approvals No | ||
Supply Current 3.4 mA | ||
Technology Digital | ||
Width 1.6 mm | ||
The Infineon TLE493D-P2B6 has extremely low quiescent current and wake up function in small package. Also the sensor provides options for configuration to fit best to customer requirements.
Platform adaptability due to device configurability
Wide application range addressable due to high flexibility
Component reduction due to 3D magnetic measurement principle
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