onsemi Single SuperFET II 1 Type N-Channel MOSFET, 4.5 A, 600 V Enhancement, 3-Pin IPAK (TO-251) FCU900N60Z

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Subtotal (1 bag of 5 units)*

R 219,86

(exc. VAT)

R 252,84

(inc. VAT)

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Units
Per unit
Per Bag*
5 - 20R 43.972R 219.86
25 - 120R 42.872R 214.36
125 - 245R 41.586R 207.93
250 - 495R 39.922R 199.61
500 +R 38.326R 191.63

*price indicative

Packaging Options:
RS stock no.:
774-1124
Mfr. Part No.:
FCU900N60Z
Manufacturer:
onsemi
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Brand

onsemi

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

4.5A

Maximum Drain Source Voltage Vds

600V

Package Type

IPAK (TO-251)

Series

SuperFET II

Pin Count

3

Channel Mode

Enhancement

Maximum Power Dissipation Pd

52W

Maximum Gate Source Voltage Vgs

30 V

Minimum Operating Temperature

-55°C

Transistor Configuration

Single

Maximum Operating Temperature

150°C

Height

6.3mm

Width

2.5 mm

Length

6.8mm

Number of Elements per Chip

1

SuperFET® and SuperFET® II N-Channel MOSFET, Fairchild Semiconductor


Fairchild added the SuperFET® II high-voltage power MOSFET family using the Super Junction Technology. It provides best-in-class robust body diode performance in AC-DC Switch Mode Power Supplies (SMPS) applications such as servers, telecom, computing, industrial power supply, UPS/ESS, solar inverter, lighting applications, which require high power density, system efficiency and reliability.

Utilizing an advanced charge balance technology, designers achieve more efficient, cost-effective and high performance solutions that take up less board space and improve reliability.

MOSFET Transistors, ON Semi


ON Semi offers a substantial portfolio of MOSFET devices that includes high-voltage (>250V) and low-voltage (<250V) types. The advanced silicon technology provides smaller die sizes, which it is incorporated into multiple industry-standard and thermally-enhanced packages.

ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.

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