onsemi QFET Type N-Channel MOSFET, 850 mA, 200 V Enhancement, 4-Pin SOT-223 FQT4N20LTF

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Subtotal (1 pack of 5 units)*

R 61,43

(exc. VAT)

R 70,645

(inc. VAT)

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Units
Per unit
Per Pack*
5 - 20R 12.286R 61.43
25 - 95R 11.978R 59.89
100 - 245R 11.618R 58.09
250 - 495R 11.154R 55.77
500 +R 10.708R 53.54

*price indicative

Packaging Options:
RS stock no.:
671-1065
Mfr. Part No.:
FQT4N20LTF
Manufacturer:
onsemi
Find similar products by selecting one or more attributes.
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Brand

onsemi

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

850mA

Maximum Drain Source Voltage Vds

200V

Series

QFET

Package Type

SOT-223

Mount Type

Surface

Pin Count

4

Maximum Drain Source Resistance Rds

1.35Ω

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

4nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

2.2W

Forward Voltage Vf

1.5V

Maximum Operating Temperature

150°C

Standards/Approvals

No

Length

6.5mm

Height

1.6mm

Automotive Standard

No

QFET® N-Channel MOSFET, up to 5.9A, Fairchild Semiconductor


Fairchild Semiconductor’s new QFET® Planar MOSFETs use advanced, proprietary technology to offer best-in-class operating performance for a wide range of applications, including power supplies, PFC (Power Factor Correction), DC-DC Converters, Plasma Display Panels (PDP), lighting ballasts, and motion control.

They offer reduced on-state loss by lowering on-resistance (RDS(on)), and reduced switching loss by lowering gate charge (Qg) and output capacitance (Coss). By using Advanced QFET® process technology, Fairchild can offer an improved figure of merit (FOM) over competing Planar MOSFET devices.

MOSFET Transistors, ON Semi


ON Semi offers a substantial portfolio of MOSFET devices that includes high-voltage (>250V) and low-voltage (<250V) types. The Advanced silicon technology provides smaller die sizes, which it is incorporated into multiple industry-standard and thermally-enhanced packages.

ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.

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