Vishay Type N-Channel MOSFET, 25 A, 40 V, 8-Pin PowerPAK ChipFET SI5448DU-T1-GE3
- RS stock no.:
- 256-7367
- Mfr. Part No.:
- SI5448DU-T1-GE3
- Manufacturer:
- Vishay
Image representative of range
Bulk discount available
Subtotal (1 pack of 25 units)*
R 137,25
(exc. VAT)
R 157,75
(inc. VAT)
FREE delivery for orders over R 1,500.00
In Stock
- 6,000 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
|---|---|---|
| 25 - 25 | R 5.49 | R 137.25 |
| 50 - 75 | R 5.353 | R 133.83 |
| 100 - 225 | R 5.192 | R 129.80 |
| 250 - 975 | R 4.985 | R 124.63 |
| 1000 + | R 4.786 | R 119.65 |
*price indicative
- RS stock no.:
- 256-7367
- Mfr. Part No.:
- SI5448DU-T1-GE3
- Manufacturer:
- Vishay
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Vishay | |
| Channel Type | Type N | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 25A | |
| Maximum Drain Source Voltage Vds | 40V | |
| Package Type | PowerPAK ChipFET | |
| Mount Type | Surface | |
| Pin Count | 8 | |
| Maximum Drain Source Resistance Rds | 1.4Ω | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | No | |
| Height | 0.85mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Vishay | ||
Channel Type Type N | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 25A | ||
Maximum Drain Source Voltage Vds 40V | ||
Package Type PowerPAK ChipFET | ||
Mount Type Surface | ||
Pin Count 8 | ||
Maximum Drain Source Resistance Rds 1.4Ω | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals No | ||
Height 0.85mm | ||
Automotive Standard No | ||
The Vishay Semiconductor N-channel mosfet surface mount powerPAK chipfet single.
TrenchFET gen IV power mosfet
100 % Rg and UIS tested
Thermally enhanced powerPAK chipFET package
Compact footprint area less than 6.09 mm2
Thin 0.8 mm profile
56 % lower RDS(ON) than the prior generation
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