Infineon CoolSiC Type N-Channel MOSFET, 25 A, 1200 V Enhancement EasyPACK FS33MR12W1M1HB70BPSA1
- RS stock no.:
- 348-981
- Mfr. Part No.:
- FS33MR12W1M1HB70BPSA1
- Manufacturer:
- Infineon
Subtotal (1 unit)*
R 3 887,64
(exc. VAT)
R 4 470,79
(inc. VAT)
FREE delivery for orders over R 1,500.00
In Stock
- 24 unit(s) ready to ship from another location
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Units | Per unit |
|---|---|
| 1 + | R 3,887.64 |
*price indicative
- RS stock no.:
- 348-981
- Mfr. Part No.:
- FS33MR12W1M1HB70BPSA1
- Manufacturer:
- Infineon
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | MOSFET | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 25A | |
| Maximum Drain Source Voltage Vds | 1200V | |
| Series | CoolSiC | |
| Package Type | EasyPACK | |
| Mount Type | Screw | |
| Maximum Drain Source Resistance Rds | 60.2mΩ | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -40°C | |
| Forward Voltage Vf | 5.35V | |
| Maximum Gate Source Voltage Vgs | 23 V | |
| Maximum Power Dissipation Pd | 20mW | |
| Maximum Operating Temperature | 150°C | |
| Standards/Approvals | IEC 60068, IEC 60749, IEC 61140, IEC 60747 | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type MOSFET | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 25A | ||
Maximum Drain Source Voltage Vds 1200V | ||
Series CoolSiC | ||
Package Type EasyPACK | ||
Mount Type Screw | ||
Maximum Drain Source Resistance Rds 60.2mΩ | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -40°C | ||
Forward Voltage Vf 5.35V | ||
Maximum Gate Source Voltage Vgs 23 V | ||
Maximum Power Dissipation Pd 20mW | ||
Maximum Operating Temperature 150°C | ||
Standards/Approvals IEC 60068, IEC 60749, IEC 61140, IEC 60747 | ||
Automotive Standard No | ||
- COO (Country of Origin):
- DE
The Infineon EasyPACK 1B CoolSiC MOSFET Six-Pack Module is engineered for high performance power applications, featuring best-in-class packaging with a compact 12.25 mm height for optimized space efficiency. Built with leading-edge Wide Bandgap (WBG) materials, it offers superior efficiency, thermal performance, and long-term reliability. Powered by Enhanced CoolSiC MOSFET Gen 1, it ensures advanced thermal management and high energy efficiency in demanding environments.
Outstanding module efficiency
System cost advantages
System efficiency improvement
Reduced cooling requirements
Enabling higher frequency
Increase of power density
Better thermal conductivity of DCB material
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