Microchip SAM9X75-V/4PB ARM926EJ-S Microprocessor SAM9X7 32 bit ARM 800 MHz 240-Pin TFBGA
- RS stock no.:
- 765-461
- Mfr. Part No.:
- SAM9X75-V/4PB
- Manufacturer:
- Microchip
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Subtotal (1 unit)*
R 105,18
(exc. VAT)
R 120,96
(inc. VAT)
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- Shipping from 08 February 2027
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Units | Per unit |
|---|---|
| 1 + | R 105.18 |
*price indicative
- RS stock no.:
- 765-461
- Mfr. Part No.:
- SAM9X75-V/4PB
- Manufacturer:
- Microchip
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Microchip | |
| Product Type | Microprocessor | |
| Series | SAM9X7 | |
| Device Core | ARM926EJ-S | |
| Data Bus Width | 32bit | |
| Instruction Set Architecture | ARM | |
| Maximum Clock Frequency | 800MHz | |
| Interface Type | CAN FD, LVDS, MPU | |
| Mount Type | Surface Mount | |
| Package Type | TFBGA | |
| Maximum Supply Voltage | 1.8V | |
| Pin Count | 240 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS | |
| Height | 1.217mm | |
| Width | 11mm | |
| Length | 11mm | |
| Automotive Standard | AEC-Q100 | |
| Number of Cores | 1 | |
| Select all | ||
|---|---|---|
Brand Microchip | ||
Product Type Microprocessor | ||
Series SAM9X7 | ||
Device Core ARM926EJ-S | ||
Data Bus Width 32bit | ||
Instruction Set Architecture ARM | ||
Maximum Clock Frequency 800MHz | ||
Interface Type CAN FD, LVDS, MPU | ||
Mount Type Surface Mount | ||
Package Type TFBGA | ||
Maximum Supply Voltage 1.8V | ||
Pin Count 240 | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS | ||
Height 1.217mm | ||
Width 11mm | ||
Length 11mm | ||
Automotive Standard AEC-Q100 | ||
Number of Cores 1 | ||
The Microchip Microprocessor is a robust Arm926ej-S core solution engineered for high-performance industrial and medical applications. Running at speeds up to 800 MHz, this MPU provides the perfect balance of low power consumption and Advanced connectivity.
Supports DDR3L and DDR2 external DRAM
Operates from -40 to 105 degrees Celsius
16 bit bus width memory interface
Housed in 240 ball TFBGA package