Infineon XMC4500E144X1024ACXQSA1, 32 bit ARM 32 Bit Cortex M4, XMC4500 Microcontroller, 120 MHz, 1024kB FLASH, 144-Pin
- RS stock no.:
- 260-5249
- Mfr. Part No.:
- XMC4500E144X1024ACXQSA1
- Manufacturer:
- Infineon
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View bulk pricing optionsSubtotal (1 tray of 240 units)*
R 36 090,72
(exc. VAT)
R 41 504,40
(inc. VAT)
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- Shipping from 26 January 2027
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Units | Per unit | Per Tray* |
|---|---|---|
| 240 - 240 | R 150.378 | R 36,090.72 |
| 480 + | R 146.619 | R 35,188.56 |
*price indicative
- RS stock no.:
- 260-5249
- Mfr. Part No.:
- XMC4500E144X1024ACXQSA1
- Manufacturer:
- Infineon
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | Microcontroller | |
| Series | XMC4500 | |
| Package Type | LFBGA | |
| Mount Type | Surface | |
| Pin Count | 144 | |
| Device Core | ARM 32 Bit Cortex M4 | |
| Data Bus Width | 32bit | |
| Interface Type | USIC, CAN, IIC, IIS, LIN, SPI, UART, USART, USB | |
| Program Memory Size | 1024kB | |
| Maximum Clock Frequency | 120MHz | |
| RAM Size | 160kB | |
| Maximum Supply Voltage | 3.63V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Width | 14mm | |
| Standards/Approvals | RoHS | |
| Number of Programmable I/Os | 91 | |
| Length | 14mm | |
| Height | 1mm | |
| Minimum Supply Voltage | 3.13V | |
| Automotive Standard | No | |
| ADCs | 12 bit | |
| Instruction Set Architecture | Thumb-2 | |
| Program Memory Type | FLASH | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type Microcontroller | ||
Series XMC4500 | ||
Package Type LFBGA | ||
Mount Type Surface | ||
Pin Count 144 | ||
Device Core ARM 32 Bit Cortex M4 | ||
Data Bus Width 32bit | ||
Interface Type USIC, CAN, IIC, IIS, LIN, SPI, UART, USART, USB | ||
Program Memory Size 1024kB | ||
Maximum Clock Frequency 120MHz | ||
RAM Size 160kB | ||
Maximum Supply Voltage 3.63V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Width 14mm | ||
Standards/Approvals RoHS | ||
Number of Programmable I/Os 91 | ||
Length 14mm | ||
Height 1mm | ||
Minimum Supply Voltage 3.13V | ||
Automotive Standard No | ||
ADCs 12 bit | ||
Instruction Set Architecture Thumb-2 | ||
Program Memory Type FLASH | ||
Infineon Microcontroller, 32-bit ARM Cortex M4 Core, 1024kByte Program Memory - XMC4500E144X1024ACXQSA1
This microcontroller is designed for robust industrial applications. It features a compact LFBGA package, with a pin count of 144, and includes a powerful 32-bit ARM Cortex M4 processor that operates at frequencies of up to 120MHz. The device boasts an extensive program memory capacity of 1024kByte and offers operating temperature
Features & Benefits
• 128 to 160KB RAM ensures efficient data handling
• Four 12-bit ADCs provide precise signal measurement
• Integrated Flash memory enhances data retention
• Supports a typical operating supply voltage of 3.3V
• Operates effectively at a maximum temperature of +105°C
Applications
• Utilised in automation control systems for enhanced productivity
• Suitable for motor control in various machinery
• Implemented in power conversion systems for efficiency
• Used for industrial sensing and control tasks
• Applied in connectivity solutions across diverse industrial sectors
What specifications ensure this microcontroller is suitable for automation tasks?
The microcontroller's three CAN channels facilitate seamless communication in automation networks. Its high processing speed of 120MHz ensures rapid data processing, vital for automation tasks, while the ADCs provide accurate sensing capabilities.
How does the memory capacity influence the capabilities of this microcontroller?
The onboard Flash memory of 1024kByte allows for extensive programme storage, which is crucial for complex applications requiring large data sets or sophisticated algorithms.
How does the LFBGA package facilitate the microcontroller’s use in various applications?
The LFBGA package provides a compact footprint while maintaining the robust connectivity needed for industrial applications, supporting high-density designs and effective thermal management.
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