TE Connectivity 0.5 mm Pitch 260 Way, Right Angle Surface Mount Mount SO DIMM Socket ,25.0 V, 500mA
- RS stock no.:
- 185-5879
- Mfr. Part No.:
- 2309409-1
- Manufacturer:
- TE Connectivity
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- RS stock no.:
- 185-5879
- Mfr. Part No.:
- 2309409-1
- Manufacturer:
- TE Connectivity
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | DIMM Socket | |
| Memory Socket Type | DIMM | |
| Orientation | Right Angle | |
| Insertion/Removal Method | Cam-In | |
| Current | 500mA | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold Flash, Nickel Plated | |
| Number of Contacts | 260 | |
| Pitch | 0.5mm | |
| Mount Type | Surface Mount | |
| Housing Material | Thermoplastic | |
| SDRAM Type | SO | |
| Termination Type | Solder | |
| Minimum Operating Temperature | 85°C | |
| Latching | Yes | |
| Row Spacing | 8.2mm | |
| Maximum Operating Temperature | 85°C | |
| Maximum Contact Resistance | 50mΩ | |
| Standards/Approvals | RoHS | |
| Series | 2309409 | |
| Voltage | 25.0 V | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type DIMM Socket | ||
Memory Socket Type DIMM | ||
Orientation Right Angle | ||
Insertion/Removal Method Cam-In | ||
Current 500mA | ||
Contact Material Copper Alloy | ||
Contact Plating Gold Flash, Nickel Plated | ||
Number of Contacts 260 | ||
Pitch 0.5mm | ||
Mount Type Surface Mount | ||
Housing Material Thermoplastic | ||
SDRAM Type SO | ||
Termination Type Solder | ||
Minimum Operating Temperature 85°C | ||
Latching Yes | ||
Row Spacing 8.2mm | ||
Maximum Operating Temperature 85°C | ||
Maximum Contact Resistance 50mΩ | ||
Standards/Approvals RoHS | ||
Series 2309409 | ||
Voltage 25.0 V | ||
TE Connectivity’s (TE) main memory connectors are made to JEDEC industry standards for dual in-line memory modules (DIMM) and small outline DIMM (SO DIMM) as well as custom memory modules for server, workstation, desktop, notebook, storage and communication applications. Our memory socket portfolio covers the DDR2, DDR3, and DDR4 generations of sockets. Each product family consists of vertical and a few right-angle and various-angled configurations in solder tail and surface mount (SMT) mounting options.
Designed to JEDEC industry standards for new and existing DIMM memory modules
Provide end latches for module retention, ejection and mechanical voltage keying
SO DIMM sockets are offered in several stacking heights to maximize board space
Applications
Servers
High Performance Computing (HPC)
Workstations
Mass storages
Communication equipment
Desktop PCs
Instrument equipment
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