OCI-440-1140p-X-TU EPIGAP OSA Photonics OCI-440 1140 nm IR LED 1515 Surface Mount package
- RS stock no.:
- 173-6276
- Mfr. Part No.:
- OCI-440-1140p-X-TU
- Manufacturer:
- EPIGAP OSA Photonics
Image representative of range
Bulk discount available
Subtotal (1 reel of 100 units)*
R 45 394,80
(exc. VAT)
R 52 204,00
(inc. VAT)
Stock information currently inaccessible - Please check back later
Units | Per unit | Per Reel* |
|---|---|---|
| 100 - 100 | R 453.948 | R 45,394.80 |
| 200 - 200 | R 442.599 | R 44,259.90 |
| 300 + | R 429.321 | R 42,932.10 |
*price indicative
- RS stock no.:
- 173-6276
- Mfr. Part No.:
- OCI-440-1140p-X-TU
- Manufacturer:
- EPIGAP OSA Photonics
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | EPIGAP OSA Photonics | |
| Product Type | IR LED | |
| Peak Wavelength | 1140nm | |
| Package Type | 1515 | |
| Radiant Flux | 42.0mW | |
| Packaging | Tape | |
| Radiant Intensity | 13.5mW/sr | |
| Mount Type | Surface Mount | |
| Number of LEDs | 1 | |
| Number of Pins | 2 | |
| Lens Shape | Round | |
| Series | OCI-440 | |
| LED Material | AlInGaP, GaAlAs, InGaN, GaP | |
| Standards/Approvals | RoHs and Reach | |
| Maximum Supply Voltage | 5V | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand EPIGAP OSA Photonics | ||
Product Type IR LED | ||
Peak Wavelength 1140nm | ||
Package Type 1515 | ||
Radiant Flux 42.0mW | ||
Packaging Tape | ||
Radiant Intensity 13.5mW/sr | ||
Mount Type Surface Mount | ||
Number of LEDs 1 | ||
Number of Pins 2 | ||
Lens Shape Round | ||
Series OCI-440 | ||
LED Material AlInGaP, GaAlAs, InGaN, GaP | ||
Standards/Approvals RoHs and Reach | ||
Maximum Supply Voltage 5V | ||
Automotive Standard No | ||
OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our standard chips can be mounted in our SMD-packages. All devices can be characterized at 20mA, 2mA (low current) and under custom specific conditions. Most of them can be packaged tape-up and tape-down. The thermal resistance of the devices itself is about 150K/W (Kelvin/Watt), depending on chip technology a power dissipation up to 10mW can be realized.
package: 1515
size: 3.8mm x 3.8mm x 0.9mm
view angle: 120°
substrate: AlN Ceramic
for High Power applications
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: silver plated
suitable for all SMT assembly methods
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