Infineon FP15R12KE3GBPSA1 3 Phase IGBT, 25 A 1200 V AG-ECONO2C-311, Chassis
- RS stock no.:
- 258-0857
- Mfr. Part No.:
- FP15R12KE3GBPSA1
- Manufacturer:
- Infineon
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Bulk discount available
Subtotal (1 unit)*
R 2 245,93
(exc. VAT)
R 2 582,82
(inc. VAT)
FREE delivery for orders over R 1,500.00
In Stock
- 2 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 1 | R 2,245.93 |
| 2 - 3 | R 2,189.78 |
| 4 - 5 | R 2,124.09 |
| 6 - 7 | R 2,039.13 |
| 8 + | R 1,957.56 |
*price indicative
- RS stock no.:
- 258-0857
- Mfr. Part No.:
- FP15R12KE3GBPSA1
- Manufacturer:
- Infineon
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | IGBT | |
| Maximum Continuous Collector Current Ic | 25A | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Maximum Power Dissipation Pd | 105W | |
| Package Type | AG-ECONO2C-311 | |
| Configuration | 3 Phase | |
| Mount Type | Chassis | |
| Minimum Operating Temperature | -40°C | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Maximum Operating Temperature | 125°C | |
| Length | 107.5mm | |
| Width | 45 mm | |
| Height | 17mm | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type IGBT | ||
Maximum Continuous Collector Current Ic 25A | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Maximum Power Dissipation Pd 105W | ||
Package Type AG-ECONO2C-311 | ||
Configuration 3 Phase | ||
Mount Type Chassis | ||
Minimum Operating Temperature -40°C | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Maximum Operating Temperature 125°C | ||
Length 107.5mm | ||
Width 45 mm | ||
Height 17mm | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
The Infineon EconoPIM 2 1200V three phase PIM IGBT module with IGBT3 and NTC is optimized customers development cycle time and cost, its fast, reliable and low cost mounting concept.
Low stray inductance module design
High reliability and power density
Copper base plate for optimized heat spread
Solder able pins
Related links
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