Amphenol Communications Solutions 1.27 mm Pitch 400 Way Surface Mount Surface Prototyping IC Socket
- RS stock no.:
- 182-2279
- Mfr. Part No.:
- 74221-101LF
- Manufacturer:
- Amphenol Communications Solutions
Image representative of range
Subtotal (250 units, on reels of 250)*
R 130 128,25
(exc. VAT)
R 149 647,50
(inc. VAT)
FREE delivery for orders over R 1,500.00
Temporarily out of stock
- Shipping from 16 March 2027
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Units | Per unit | Per Reel* |
|---|---|---|
| 250 + | R 520.513 | R 130,128.25 |
*price indicative
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Each
R 689.63
(exc. VAT)
R 793.07
(inc. VAT)
- RS stock no.:
- 182-2279
- Mfr. Part No.:
- 74221-101LF
- Manufacturer:
- Amphenol Communications Solutions
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol Communications Solutions | |
| IC Socket Type | Prototyping Socket | |
| Package Type | Surface Mount | |
| Product Type | IC Socket | |
| Number of Contacts | 400 | |
| Current | 450mA | |
| Number of Rows | 8 | |
| Pitch | 1.27mm | |
| Voltage | 200V | |
| Orientation | Straight | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Socket Mount Type | Surface | |
| Minimum Operating Temperature | -55°C | |
| Device Mount Type | Surface | |
| Row Pitch | 1.27mm | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 85°C | |
| Series | Meg-Array | |
| Standards/Approvals | No | |
| Housing Material | Liquid Crystal Polymer | |
| Select all | ||
|---|---|---|
Brand Amphenol Communications Solutions | ||
IC Socket Type Prototyping Socket | ||
Package Type Surface Mount | ||
Product Type IC Socket | ||
Number of Contacts 400 | ||
Current 450mA | ||
Number of Rows 8 | ||
Pitch 1.27mm | ||
Voltage 200V | ||
Orientation Straight | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Socket Mount Type Surface | ||
Minimum Operating Temperature -55°C | ||
Device Mount Type Surface | ||
Row Pitch 1.27mm | ||
Termination Type Solder | ||
Maximum Operating Temperature 85°C | ||
Series Meg-Array | ||
Standards/Approvals No | ||
Housing Material Liquid Crystal Polymer | ||
- COO (Country of Origin):
- US
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
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