Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, QFN to DIP
- RS stock no.:
- 741-9521
- Mfr. Part No.:
- W13023RC
- Manufacturer:
- Winslow
Bulk discount available
View bulk pricing optionsSubtotal (1 pack of 5 units)*
R 1 029,01
(exc. VAT)
R 1 183,36
(inc. VAT)
FREE delivery for orders over R 1,500.00
In Stock
- 30 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
|---|---|---|
| 5 - 120 | R 205.802 | R 1,029.01 |
| 125 - 370 | R 200.656 | R 1,003.28 |
| 375 - 995 | R 194.636 | R 973.18 |
| 1000 - 1995 | R 186.85 | R 934.25 |
| 2000 + | R 179.376 | R 896.88 |
*price indicative
- RS stock no.:
- 741-9521
- Mfr. Part No.:
- W13023RC
- Manufacturer:
- Winslow
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | QFN | |
| Number of Contacts A | 20 | |
| Connection Gender A | Female | |
| Connection Gender B | Male | |
| Number of Contacts B | 20 | |
| Connection B | DIP | |
| Pitch | 2.54mm | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Brass | |
| Housing Material | Fibreglass | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A QFN | ||
Number of Contacts A 20 | ||
Connection Gender A Female | ||
Connection Gender B Male | ||
Number of Contacts B 20 | ||
Connection B DIP | ||
Pitch 2.54mm | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Brass | ||
Housing Material Fibreglass | ||
- COO (Country of Origin):
- GB
QFN to DIP Pin Adapters
'Adaptics' converting Dual-Flat No-Leads and Quad-Flat No-Leads packages (DFN and QFN) to Dual In Line Package (DIP) format.
IC Sockets-Package Adaptics
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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