Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, PLCC to PGA
- RS stock no.:
- 741-9335
- Mfr. Part No.:
- WA032127DAJTRC
- Manufacturer:
- Winslow
Image representative of range
Bulk discount available
Subtotal (1 unit)*
R 277,91
(exc. VAT)
R 319,60
(inc. VAT)
Stock information currently inaccessible - Please check back later
Units | Per unit |
|---|---|
| 1 - 9 | R 277.91 |
| 10 - 24 | R 270.96 |
| 25 - 49 | R 262.83 |
| 50 - 99 | R 252.32 |
| 100 + | R 242.23 |
*price indicative
- RS stock no.:
- 741-9335
- Mfr. Part No.:
- WA032127DAJTRC
- Manufacturer:
- Winslow
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | PLCC | |
| Connection Gender A | Female | |
| Number of Contacts A | 32 | |
| Number of Contacts B | 32 | |
| Connection Gender B | Male | |
| Series | WAxx127DAJT / WAxx127DSAJT | |
| Contact Plating | Tin over Nickel | |
| Pitch | 2.54mm | |
| Connection B | PGA | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Brass | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A PLCC | ||
Connection Gender A Female | ||
Number of Contacts A 32 | ||
Number of Contacts B 32 | ||
Connection Gender B Male | ||
Series WAxx127DAJT / WAxx127DSAJT | ||
Contact Plating Tin over Nickel | ||
Pitch 2.54mm | ||
Connection B PGA | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Brass | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
PLCC Pads to PGA Pin Adapters
These Winslow Adaptics PLCC with Pads to PGA Pin Adapters have a 1.6mm above board height.
IC Sockets-Package Adaptics
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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