AAVID THERMALLOY Heatsink, D3 PAK (TO-268), power SO-10 (MO-184), SO-10, D2 PAK (TO-263), D-PAK (TO-252), 18°C/W 10.16
- RS stock no.:
- 712-4217
- Mfr. Part No.:
- 573300D00010G
- Manufacturer:
- AAVID THERMALLOY
Bulk discount available
View bulk pricing optionsSubtotal (1 pack of 5 units)*
R 113,61
(exc. VAT)
R 130,65
(inc. VAT)
FREE delivery for orders over R 1,500.00
In Stock
- 2,560 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
|---|---|---|
| 5 - 120 | R 22.722 | R 113.61 |
| 125 - 495 | R 22.154 | R 110.77 |
| 500 - 1245 | R 21.49 | R 107.45 |
| 1250 - 2495 | R 20.63 | R 103.15 |
| 2500 + | R 19.804 | R 99.02 |
*price indicative
- RS stock no.:
- 712-4217
- Mfr. Part No.:
- 573300D00010G
- Manufacturer:
- AAVID THERMALLOY
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | AAVID THERMALLOY | |
| For Use With | D3 PAK (TO-268), power SO-10 (MO-184), SO-10, D2 PAK (TO-263), D-PAK (TO-252) | |
| Product Type | Heatsink | |
| Length | 12.7mm | |
| Width | 26.16mm | |
| Height | 10.16mm | |
| Thermal Resistance | 18°C/W | |
| Fastening | PCB Mount | |
| Colour | Silver | |
| Finish | Tin Plated | |
| Standards/Approvals | RoHS | |
| Application | Surface Mount Heat Sink, Power Supplies, Package Semiconductor | |
| Material | Copper | |
| Select all | ||
|---|---|---|
Brand AAVID THERMALLOY | ||
For Use With D3 PAK (TO-268), power SO-10 (MO-184), SO-10, D2 PAK (TO-263), D-PAK (TO-252) | ||
Product Type Heatsink | ||
Length 12.7mm | ||
Width 26.16mm | ||
Height 10.16mm | ||
Thermal Resistance 18°C/W | ||
Fastening PCB Mount | ||
Colour Silver | ||
Finish Tin Plated | ||
Standards/Approvals RoHS | ||
Application Surface Mount Heat Sink, Power Supplies, Package Semiconductor | ||
Material Copper | ||
D-PAK Heatsinks, Aavid Thermalloy
Surface mount heatsink for D-PAK package semiconductors
The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package
tab to the heat sink
D-PAK Package Heatsinks
Related links
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