Fischer Elektronik Heatsink, Universal Round Alu, 4.25°C/W 18.5 mm
- RS stock no.:
- 674-4832
- Mfr. Part No.:
- ICK S R 28,5x18,5
- Manufacturer:
- Fischer Elektronik
Bulk discount available
Subtotal (1 unit)*
R 206,18
(exc. VAT)
R 237,11
(inc. VAT)
FREE delivery for orders over R 1,500.00
In Stock
- 4 unit(s) ready to ship from another location
- Plus 25 unit(s) shipping from 20 April 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 9 | R 206.18 |
| 10 - 49 | R 201.03 |
| 50 - 99 | R 195.00 |
| 100 - 249 | R 187.20 |
| 250 + | R 179.71 |
*price indicative
- RS stock no.:
- 674-4832
- Mfr. Part No.:
- ICK S R 28,5x18,5
- Manufacturer:
- Fischer Elektronik
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Fischer Elektronik | |
| For Use With | Universal Round Alu | |
| Product Type | Heatsink | |
| Height | 18.5mm | |
| Fastening | Clamp, Glue, Integrated clamp, Screw | |
| Thermal Resistance | 4.25°C/W | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | PLCC, DIL/IC, PGA, BGA, LED, SMD | |
| Standards/Approvals | No | |
| Application | Heat Sink For Pentium II Mobile Module, Heat Sink For IC, Heat Sink For Power PC, Heat Sink For Microprocessor, Heat Sink For Pentium III/Xeon, Heat Sink For Dil and Ic, Heat Sink For PLCC, Heat Sink For Bga, Heat Sink For Pentium Pro, Fan, SMD, Cooler, Heatsink for PGA | |
| Material | Aluminium Alloy, Thermally Conductive Glue, Thermally Conductive Foil | |
| Select all | ||
|---|---|---|
Brand Fischer Elektronik | ||
For Use With Universal Round Alu | ||
Product Type Heatsink | ||
Height 18.5mm | ||
Fastening Clamp, Glue, Integrated clamp, Screw | ||
Thermal Resistance 4.25°C/W | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type PLCC, DIL/IC, PGA, BGA, LED, SMD | ||
Standards/Approvals No | ||
Application Heat Sink For Pentium II Mobile Module, Heat Sink For IC, Heat Sink For Power PC, Heat Sink For Microprocessor, Heat Sink For Pentium III/Xeon, Heat Sink For Dil and Ic, Heat Sink For PLCC, Heat Sink For Bga, Heat Sink For Pentium Pro, Fan, SMD, Cooler, Heatsink for PGA | ||
Material Aluminium Alloy, Thermally Conductive Glue, Thermally Conductive Foil | ||
- COO (Country of Origin):
- DE
ICK S R Series
Round heatsinks for ICs, which are also designed for use with LEDs (see also ICK LED R heatsinks, typical SN 674-4771 )
Al-natural surface
Mounting by clamp, foil or adhesive
PGA Heatsinks
Related links
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