Alliance Memory NAND 64000 MB EMMC Flash Memory 153-Pin FBGA, ASFC64G31T5-51BIN
- RS stock no.:
- 665-371
- Mfr. Part No.:
- ASFC64G31T5-51BIN
- Manufacturer:
- Alliance Memory
Subtotal (1 unit)*
R 412,81
(exc. VAT)
R 474,73
(inc. VAT)
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In Stock
- Plus 146 unit(s) shipping from 05 February 2026
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Units | Per unit |
|---|---|
| 1 + | R 412.81 |
*price indicative
- RS stock no.:
- 665-371
- Mfr. Part No.:
- ASFC64G31T5-51BIN
- Manufacturer:
- Alliance Memory
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Alliance Memory | |
| Product Type | Flash Memory | |
| Memory Size | 64000MB | |
| Interface Type | EMMC | |
| Package Type | FBGA | |
| Pin Count | 153 | |
| Organisation | 64G x 8 | |
| Maximum Clock Frequency | 200MHz | |
| Cell Type | NAND | |
| Minimum Supply Voltage | 1.7V | |
| Maximum Supply Voltage | 3.6V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | JEDEC e·MMC 5.1 (JESD84-B51), RoHS | |
| Height | 1.2mm | |
| Width | 11.5 mm | |
| Length | 13mm | |
| Number of Bits per Word | 8 | |
| Supply Current | 0.06mA | |
| Series | ASFC | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Alliance Memory | ||
Product Type Flash Memory | ||
Memory Size 64000MB | ||
Interface Type EMMC | ||
Package Type FBGA | ||
Pin Count 153 | ||
Organisation 64G x 8 | ||
Maximum Clock Frequency 200MHz | ||
Cell Type NAND | ||
Minimum Supply Voltage 1.7V | ||
Maximum Supply Voltage 3.6V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals JEDEC e·MMC 5.1 (JESD84-B51), RoHS | ||
Height 1.2mm | ||
Width 11.5 mm | ||
Length 13mm | ||
Number of Bits per Word 8 | ||
Supply Current 0.06mA | ||
Series ASFC | ||
Automotive Standard No | ||
- COO (Country of Origin):
- DE
The Alliance Memory 64GB eMMC in a 153-ball FBGA package is a managed non-volatile storage device consisting of an integrated MMC controller and NAND flash memory within a JEDEC-defined standard BGA package. It is specifically designed as a compact memory solution for data storage and boot media. Optimized for predominantly read operations with low power consumption, it utilizes 3D TLC NAND technology and offers an optional Enhanced mode (pSLC) configuration to meet higher industrial performance demands. The device also supports industrial temperature grade specifications
3D TLC NAND base technology
Boot Operation Mode and Alternative Boot Operation Mode
Replay Protected Memory Block (RPMB)
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