TDK-Lambda RGA DC-DC Converter, 3.3 → 15V dc/ 20A Output, 9 → 53 V dc Input, 250W, PCB Mount, -40°C Max
- RS stock no.:
- 242-644
- Distrelec Article No.:
- 304-11-732
- Mfr. Part No.:
- RGA4W250W020A-001
- Manufacturer:
- TDK-Lambda
Subtotal (1 unit)*
R 1 052,16
(exc. VAT)
R 1 209,98
(inc. VAT)
Stock information currently inaccessible - Please check back later
Units | Per unit |
|---|---|
| 1 + | R 1,052.16 |
*price indicative
- RS stock no.:
- 242-644
- Distrelec Article No.:
- 304-11-732
- Mfr. Part No.:
- RGA4W250W020A-001
- Manufacturer:
- TDK-Lambda
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK-Lambda | |
| Output Voltage | 3.3 → 15V dc | |
| Input Voltage Range | 9 → 53 V dc | |
| Power Rating | 250W | |
| Input Voltage Nominal | 24/48 V dc | |
| Output Current | 20A | |
| Mounting Type | PCB Mount | |
| Series | RGA | |
| Minimum Temperature | +110°C | |
| Maximum Temperature | -40°C | |
| Select all | ||
|---|---|---|
Brand TDK-Lambda | ||
Output Voltage 3.3 → 15V dc | ||
Input Voltage Range 9 → 53 V dc | ||
Power Rating 250W | ||
Input Voltage Nominal 24/48 V dc | ||
Output Current 20A | ||
Mounting Type PCB Mount | ||
Series RGA | ||
Minimum Temperature +110°C | ||
Maximum Temperature -40°C | ||
- COO (Country of Origin):
- MY
The TDK Lambda DC To DC Step Down Converters are encapsulated in a five sided aluminum case and are rated for operation in temperatures up to 110°C. These modules feature the industry standard 1/16th brick pin out and are qualified to MIL STD 810G for shock and vibration, making them ideal for fan less, conduction cooled applications. They support a wide input range for compatibility with various DC bus and battery voltages. Standard and optional features include remote on/off, remote sense, power good, frequency synchronization, and output sequencing, offering a flexible and reliable power solution for demanding applications.
Low component count with minimal external components
High power density
Less board area needed
Improves EMI
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