50 Ω STMicroelectronics PCB Chip Balun
- RS stock no.:
- 276-891
- Mfr. Part No.:
- BALF-WL-00D3
- Manufacturer:
- STMicroelectronics
Image representative of range
Bulk discount available
Subtotal (1 tape of 10 units)*
R 165,46
(exc. VAT)
R 190,28
(inc. VAT)
FREE delivery for orders over R 1,500.00
In Stock
- Plus 300 unit(s) shipping from 04 March 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Tape* |
|---|---|---|
| 10 - 90 | R 16.546 | R 165.46 |
| 100 - 240 | R 16.132 | R 161.32 |
| 250 - 490 | R 15.648 | R 156.48 |
| 500 - 990 | R 15.022 | R 150.22 |
| 1000 + | R 14.421 | R 144.21 |
*price indicative
- RS stock no.:
- 276-891
- Mfr. Part No.:
- BALF-WL-00D3
- Manufacturer:
- STMicroelectronics
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Unbalance Impedance | 50Ω | |
| Product Type | Chip Balun | |
| Balance Impedance | 50Ω | |
| Maximum Insertion Loss | 1.25dB | |
| Mount Type | PCB | |
| Pin Count | 15 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | ECOPACK2 | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Unbalance Impedance 50Ω | ||
Product Type Chip Balun | ||
Balance Impedance 50Ω | ||
Maximum Insertion Loss 1.25dB | ||
Mount Type PCB | ||
Pin Count 15 | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals ECOPACK2 | ||
- COO (Country of Origin):
- CN
The STMicroelectronics Ultra miniature balun integrates a matching network, balun and harmonics filter. Matching impedance has been customized for the STM32WL sub GHz wireless microcontrollers. It is using STMicroelectronics IPD technology on a nonconductive glass substrate, which optimizes RF performances.
50 ohm nominal impedance on antenna side
Deep rejection harmonics filter
Low insertion loss
Small footprint
High RF performances
RF BOM and area reduction
ECOPACK2 compliant component
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