Molex, 76060 1.9 mm Pitch Backplane Connector, Right Angle Female, 16 Column, 15 Row, 240 Way

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Subtotal (1 tray of 8 units)*

R 4 216,464

(exc. VAT)

R 4 848,936

(inc. VAT)

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  • Ready to ship from 06 July 2026
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Units
Per unit
Per Tray*
8 - 32R 527.058R 4,216.46
40 +R 513.881R 4,111.05

*price indicative

RS stock no.:
694-038
Mfr. Part No.:
76060-3126
Manufacturer:
Molex
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Brand

Molex

Product Type

Backplane Connector

Number of Contacts

240

Current

0.75A

Number of Columns

16

Orientation

Right Angle

Number of Rows

15

Connector Gender

Female

Voltage

30V

Housing Material

High Temperature Thermoplastic

Pitch

1.9mm

Mount Type

Through Hole

Contact Material

High Performance Alloy

Contact Plating

Gold

Minimum Operating Temperature

-55°C

Termination Type

Press Fit

Maximum Operating Temperature

85°C

Standards/Approvals

RoHS Compliant

Series

76060

COO (Country of Origin):
SG
The Molex Impact 100 Ohm 5 Pair Right-Angle Daughtercard Receptacle is designed for precision connectivity in backplane applications. Offering exceptional durability and reliability, this component features a left-guided design with 16 columns and 240 circuits, allowing for efficient data transmission rates of up to 25.0 Gbps. The receptacle is crafted from high-performance alloy, ensuring robust connections while maintaining low-halogen compliance. With a lead-free construction and a temperature range of -55° to +85°C, it is engineered to perform reliably in demanding environments, making it an Ideal choice for conventional daughtercard applications.

240 circuits enable high-density connectivity for optimal performance

Durable construction supports up to 200 mating cycles, ensuring longevity

Designed for 100Ω impedance, facilitating effective data integrity

Black resin colour provides a professional finish suitable for various applications

Compatible with the Impact vertical connector series for versatile usage

Robust voltage tolerance of 30V AC/DC enhances safety and reliability

Compact form factor aids in efficient design of electronic assemblies

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