MG Chemicals 8329 TCS Thermal Adhesive
- RS stock no.:
- 918-5021
- Mfr. Part No.:
- 8329TCS-50ML
- Manufacturer:
- MG Chemicals
Bulk discount available
Subtotal (1 unit)*
R 1 765,61
(exc. VAT)
R 2 030,45
(inc. VAT)
FREE delivery for orders over R 1,500.00
In Stock
- 3 unit(s) ready to ship from another location
- Plus 12 unit(s) shipping from 23 April 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 14 | R 1,765.61 |
| 15 - 39 | R 1,721.47 |
| 40 + | R 1,669.83 |
*price indicative
- RS stock no.:
- 918-5021
- Mfr. Part No.:
- 8329TCS-50ML
- Manufacturer:
- MG Chemicals
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | MG Chemicals | |
| Product Type | Thermal Adhesive | |
| Trade Name | 8329 TCS | |
| Standards/Approvals | No | |
| Select all | ||
|---|---|---|
Brand MG Chemicals | ||
Product Type Thermal Adhesive | ||
Trade Name 8329 TCS | ||
Standards/Approvals No | ||
- COO (Country of Origin):
- CA
MG Chemicals 8329 Slow Cure Conductive Adhesives
The MG Chemicals 8329TCS is a slow cure thermal conductive epoxy adhesive with excellent bonding strength and good thermal transfers is used for thermal management of high-powered electronics and LEDs. Once cured, the epoxy adhesive is inert under normal conditions so resists water and salt exposure.
Feature and Benefits
Easy to mix 1:1 mix ratio
Long shelf life
Adheres to most electronic substrates
Behaves like a 1-part adhesive for the length of a work shift
Once cured resists thermal and mechanical shocks in electronic assemblies
Typical Applications
Use as a die attach for electrical and electronics
Heat sink bonding
Use as a high-powered LED adhesive that maximises the lifetime of LEDs by dissipating their heat
Note
For substrate substances with weak adhesion strengths, surface preparation such as sanding or pre-coating with a suitable primer sometimes improves adhesion.
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