STMicroelectronics, STM32WB 200 V 2.4GHz Harmonic Filter
- RS stock no.:
- 213-3379
- Mfr. Part No.:
- MLPF-WB-01E3
- Manufacturer:
- STMicroelectronics
Bulk discount available
Subtotal (1 pack of 50 units)*
R 153,05
(exc. VAT)
R 176,00
(inc. VAT)
FREE delivery for orders over R 1,500.00
In Stock
- Plus 4,300 unit(s) shipping from 16 December 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
|---|---|---|
| 50 - 50 | R 3.061 | R 153.05 |
| 100 - 450 | R 2.984 | R 149.20 |
| 500 - 950 | R 2.895 | R 144.75 |
| 1000 - 2450 | R 2.779 | R 138.95 |
| 2500 + | R 2.668 | R 133.40 |
*price indicative
- RS stock no.:
- 213-3379
- Mfr. Part No.:
- MLPF-WB-01E3
- Manufacturer:
- STMicroelectronics
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Maximum Voltage Rating | 200 V | |
| Series | STM32WB | |
| Operating Frequency | 2.4GHz | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Maximum Voltage Rating 200 V | ||
Series STM32WB | ||
Operating Frequency 2.4GHz | ||
The STMicroelectronics MLPF-WB integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance. It is 2.4 GHz low pass filter matched to STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx and STM32WB30Cx
Integrated impedance matching to STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx and STM32WB30Cx
LGA footprint compatible
50 Ω nominal impedance on antenna side
Deep rejection harmonics filter
Low insertion loss
Small footprint
Low thickness ≤ 450 μm
High RF performance
RF BOM and area reduction
ECOPACK2 compliant
LGA footprint compatible
50 Ω nominal impedance on antenna side
Deep rejection harmonics filter
Low insertion loss
Small footprint
Low thickness ≤ 450 μm
High RF performance
RF BOM and area reduction
ECOPACK2 compliant
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