Molex 43650 Series Vertical Through Hole PCB Header, 2 Contact(s), 3 mm Pitch, 1 Row, Shrouded

Bulk discount available

Subtotal (1 pack of 5 units)*

R 123,98

(exc. VAT)

R 142,58

(inc. VAT)

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Pack(s)
Per Pack
Per unit*
1 - 4R 123.98R 24.796
5 - 9R 120.88R 24.176
10 +R 117.25R 23.45

*price indicative

RS stock no.:
665-978
Mfr. Part No.:
436500229
Manufacturer:
Molex
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Brand

Molex

Product Type

PCB Header

Series

43650

Current

8.5A

Pitch

3mm

Housing Material

Thermoplastic

Number of Contacts

2

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Material

Brass

Contact Plating

Tin

Minimum Operating Temperature

-40°C

Termination Type

Through Hole

Maximum Operating Temperature

105°C

Tail Pin Length

3.18mm

COO (Country of Origin):
MX
The Molex Micro-Fit 3.0 Vertical Header is meticulously designed for seamless power connections in wire-to-board applications. With a Compact 3.00mm pitch and a robust single-row configuration, this header ensures efficient organization and enhanced connectivity. Its high temperature, glow-wire capable construction adheres to international flammability standards, providing peace of mind for safety-conscious designs. The inclusion of a PCB polarizing peg reinforces component stability while allowing for easy assembly. Ideal for use in environments demanding reliability, the Micro-Fit 3.0 offers versatility for various applications in consumer electronics, automotive systems, and more. Elevate your designs with a product built to excel under pressure and deliver consistent performance.

Supports a maximum current of 8.5A, capable of handling demanding applications
Vertical orientation and through-hole termination style enhance integration ease
Manufactured from high-temperature thermoplastic, ensuring longevity in tough environments
Available in tray packaging, facilitating straightforward storage and handling
Compatible with various Micro-Fit 3.0 cable assemblies, providing versatility in application

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