Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, QFN to DIP
- RS stock no.:
- 741-9555
- Mfr. Part No.:
- W13077RC
- Manufacturer:
- Winslow
Image representative of range
Bulk discount available
Subtotal (1 pack of 5 units)*
R 1 710,59
(exc. VAT)
R 1 967,18
(inc. VAT)
FREE delivery for orders over R 1,500.00
In Stock
- 25 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
|---|---|---|
| 5 - 120 | R 342.118 | R 1,710.59 |
| 125 - 370 | R 333.566 | R 1,667.83 |
| 375 - 995 | R 323.56 | R 1,617.80 |
| 1000 - 1995 | R 310.618 | R 1,553.09 |
| 2000 + | R 298.194 | R 1,490.97 |
*price indicative
- RS stock no.:
- 741-9555
- Mfr. Part No.:
- W13077RC
- Manufacturer:
- Winslow
Specification
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | QFN | |
| Number of Contacts A | 28 | |
| Connection Gender A | Female | |
| Connection Gender B | Male | |
| Number of Contacts B | 28 | |
| Connection B | DIP | |
| Pitch | 2.54mm | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Brass | |
| Housing Material | Fibreglass | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A QFN | ||
Number of Contacts A 28 | ||
Connection Gender A Female | ||
Connection Gender B Male | ||
Number of Contacts B 28 | ||
Connection B DIP | ||
Pitch 2.54mm | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Brass | ||
Housing Material Fibreglass | ||
- COO (Country of Origin):
- GB
QFN to DIP Pin Adapters
'Adaptics' converting Dual-Flat No-Leads and Quad-Flat No-Leads packages (DFN and QFN) to Dual In Line Package (DIP) format.
IC Sockets-Package Adaptics
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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