Surface mount heatsink for D-PAK package semiconductors The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink
D-PAK Package Heatsinks
Attribute
Value
For Use With
D2 PAK (TO-263)
Length
25.4mm
Width
19.38mm
Height
11.43mm
Dimensions
25.4 x 19.38 x 11.43mm
Thermal Resistance
11°C/W
Mounting
Horizontal
Series
7109
Material
Aluminium
Application
Through Hole Discrete Semiconductors
Package Type
TO-263
Finish
Tin Plated
Special Features
The Device and the Heat Sink are Soldered Directly to a Modified Drain Pad Creating a Thermal Transfer Path from Package Tab to the Heat Sink
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