FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
1206 Range
C0G (NP0) is the most popular formulation of the "temperature-compensating", EIA Class I ceramic materials X7R formulations are called "temperature stable" ceramics and fall into EIA Class II materials Y5V formulations are for general-purpose use in a limited temperature range.These characteristics make Y5V ideal for decoupling applications
