- RS stock no.:
- 182-3116
- Mfr. Part No.:
- 84512-102LF
- Manufacturer:
- Amphenol Communications Solutions
547 Available from UK/Europe in 4–6 working days for collection or delivery to major cities (Heavy, hazardous or lithium product excluded. Delivery T&C's apply)
Not Available for premium delivery
Added
Price (Excl VAT) Each
R 492,62
(exc. VAT)
R 566,51
(inc. VAT)
Units | Per unit |
1 - 9 | R 492,62 |
10 - 24 | R 480,30 |
25 - 49 | R 465,89 |
50 - 99 | R 447,25 |
100 + | R 429,36 |
- RS stock no.:
- 182-3116
- Mfr. Part No.:
- 84512-102LF
- Manufacturer:
- Amphenol Communications Solutions
Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- US
Product Details
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
100 Position BGA Plug, 0 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
Specification
Attribute | Value |
---|---|
Number of Contacts | 100 |
Number of Rows | 10 |
Gender | Female |
Pitch | 1.27mm |
Contact Plating | Gold |
Series | Meg-Array |
Minimum Operating Temperature | -65.0°C |
Maximum Operating Temperature | 105.0°C |
Contact Material | Copper |
- RS stock no.:
- 182-3116
- Mfr. Part No.:
- 84512-102LF
- Manufacturer:
- Amphenol Communications Solutions